Structure of copper-doped tungsten oxide films for solid-state memory

C. Gopalan; Michael Kozicki; S. Bhagat; S. C. Puthen Thermadam; Terry Alford; M. Mitkova

doi:10.1016/j.jnoncrysol.2007.02.054

Structure of copper-doped tungsten oxide films for solid-state memory

C. Gopalan, Michael Kozicki, S. Bhagat, S. C. Puthen Thermadam, Terry Alford, M. Mitkova

Research output: Contribution to journal › Article › peer-review

23 Scopus citations

Abstract

Copper-doped WO₃ films, which are an active media for programmable metallization cell memory devices, are studied. The highlights of this study are the intercalation products forming on the interface between the WO₃ and Cu during thermal evaporation and also after thermal or photothermal diffusion of Cu into WO₃ films. The diffusion profile is established using Auger spectroscopy. Further characterization is provided using Raman spectroscopy which gives evidence for formation of products with a lower valence state related to W and oxidation products related to Cu. The composition of the intercalation products containing Cu is confirmed using X-ray diffraction which shows the formation of copper oxides and tungstates.

Original language	English (US)
Pages (from-to)	1844-1848
Number of pages	5
Journal	Journal of Non-Crystalline Solids
Volume	353
Issue number	18-21
DOIs	https://doi.org/10.1016/j.jnoncrysol.2007.02.054
State	Published - Jun 15 2007

Keywords

Microcrystallinity
Phonons
Raman scattering
X-ray diffraction

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Ceramics and Composites
Condensed Matter Physics
Materials Chemistry

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10.1016/j.jnoncrysol.2007.02.054

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title = "Structure of copper-doped tungsten oxide films for solid-state memory",

abstract = "Copper-doped WO3 films, which are an active media for programmable metallization cell memory devices, are studied. The highlights of this study are the intercalation products forming on the interface between the WO3 and Cu during thermal evaporation and also after thermal or photothermal diffusion of Cu into WO3 films. The diffusion profile is established using Auger spectroscopy. Further characterization is provided using Raman spectroscopy which gives evidence for formation of products with a lower valence state related to W and oxidation products related to Cu. The composition of the intercalation products containing Cu is confirmed using X-ray diffraction which shows the formation of copper oxides and tungstates.",

keywords = "Microcrystallinity, Phonons, Raman scattering, X-ray diffraction",

author = "C. Gopalan and Michael Kozicki and S. Bhagat and {Puthen Thermadam}, {S. C.} and Terry Alford and M. Mitkova",

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T1 - Structure of copper-doped tungsten oxide films for solid-state memory

AU - Gopalan, C.

AU - Kozicki, Michael

AU - Bhagat, S.

AU - Puthen Thermadam, S. C.

AU - Alford, Terry

AU - Mitkova, M.

PY - 2007/6/15

Y1 - 2007/6/15

N2 - Copper-doped WO3 films, which are an active media for programmable metallization cell memory devices, are studied. The highlights of this study are the intercalation products forming on the interface between the WO3 and Cu during thermal evaporation and also after thermal or photothermal diffusion of Cu into WO3 films. The diffusion profile is established using Auger spectroscopy. Further characterization is provided using Raman spectroscopy which gives evidence for formation of products with a lower valence state related to W and oxidation products related to Cu. The composition of the intercalation products containing Cu is confirmed using X-ray diffraction which shows the formation of copper oxides and tungstates.

AB - Copper-doped WO3 films, which are an active media for programmable metallization cell memory devices, are studied. The highlights of this study are the intercalation products forming on the interface between the WO3 and Cu during thermal evaporation and also after thermal or photothermal diffusion of Cu into WO3 films. The diffusion profile is established using Auger spectroscopy. Further characterization is provided using Raman spectroscopy which gives evidence for formation of products with a lower valence state related to W and oxidation products related to Cu. The composition of the intercalation products containing Cu is confirmed using X-ray diffraction which shows the formation of copper oxides and tungstates.

KW - Microcrystallinity

KW - Phonons

KW - Raman scattering

KW - X-ray diffraction

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ER -

Structure of copper-doped tungsten oxide films for solid-state memory

Abstract

Keywords

ASJC Scopus subject areas

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