Abstract
A low resistance non-alloyed Pd-Ge ohmic contact to epitaxially lifted-off n-type GaAs was demonstrated. The contact is formed by lifting-off partially metallized n-type GaAs films using the ELO technique, and bonding them to bilayer metallized Si by natural intermolecular forces. Low temperature annealing of this contact results in metallurgical bonding and formation of the ohmic contact. Extensive structural and chemical analysis of both as-grown and annealed material was performed using high resolution electron microscopy and scanning transmission electron microscopy combined with energy dispersive X-ray spectroscopy.
Original language | English (US) |
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Title of host publication | Proceedings - Annual Meeting, Microscopy Society of America |
Editors | G.W. Bailey, A.J. Garratt-Reed |
Pages | 842-843 |
Number of pages | 2 |
State | Published - 1994 |
Event | Proceedings of the 52nd Annual Meeting of the Microscopy Society of America - New Orleans, LA, USA Duration: Jul 31 1994 → Aug 5 1994 |
Other
Other | Proceedings of the 52nd Annual Meeting of the Microscopy Society of America |
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City | New Orleans, LA, USA |
Period | 7/31/94 → 8/5/94 |
ASJC Scopus subject areas
- Engineering(all)