Structural optimization in electronic communication products

Subramaniam Rajan, Ben Nagaraj

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Structural optimization techniques used in microelectronic packages and pager components are discussed. In the area of microelectronic, two problems are discussed: Plastic power package; Plastic Ball grid array package. The shape optimization of the battery contact to satisfy the design requirements of a pager is presented. Additionally, the usefulness of the optimization tool and its present limitations are discussed.

Original languageEnglish (US)
Title of host publicationProceedings of the Conference on Optimization in Industry
EditorsA.D. Belegundu, F. Mistree
Place of PublicationFairfield, NJ, United States
PublisherASME
Pages159-168
Number of pages10
StatePublished - 1997
EventProceedings of the 1997 Conference on Optimization in Industry - Palm Coast, FL, USA
Duration: Mar 23 1997Mar 27 1997

Other

OtherProceedings of the 1997 Conference on Optimization in Industry
CityPalm Coast, FL, USA
Period3/23/973/27/97

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Rajan, S., & Nagaraj, B. (1997). Structural optimization in electronic communication products. In A. D. Belegundu, & F. Mistree (Eds.), Proceedings of the Conference on Optimization in Industry (pp. 159-168). ASME.