Structural characterization of thin Co/Cu superlattices

David Smith, A. R. Modak, S. S P Parkin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High-resolution electron microscopy has been used to characterize the microstructure of thin Co/Cu metallic multilayers grown on Si(100) substrates by dc magnetron sputtering. The nature of the buffer layer between the silicon wafer and the multilayer had a significant effect on the structural integrity of the multilayer. An increase in grain size was observed as a function of Cu layer thickness, with grain sizes typically being at least 3-4 times the bilayer period. A high degree of structural ordering was observed in superlattices comprised of thicker Cu layer with large grains often spanning the complete multilayer stack. Complementary magnetic measurements enabled the microstructure to be related to the oscillatory exchange coupling and large magnetoresistance exhibited by these thin magnetic films.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium Proceedings
EditorsB.T. Jonker, W.J.M. de Jonge, R.F.C. Farrow, C. Chappert, R. Clarke, al et al
Place of PublicationPittsburgh, PA, United States
PublisherPubl by Materials Research Society
Pages437-442
Number of pages6
Volume313
ISBN (Print)1558992111
StatePublished - 1993
EventProceedings of the 1993 MRS Spring Meeting on Magnetic Ultrathin Films - San Francisco, CA, USA
Duration: Apr 12 1993Apr 16 1993

Other

OtherProceedings of the 1993 MRS Spring Meeting on Magnetic Ultrathin Films
CitySan Francisco, CA, USA
Period4/12/934/16/93

Fingerprint

Superlattices
Multilayers
Magnetic thin films
Exchange coupling
Microstructure
High resolution electron microscopy
Magnetic variables measurement
Structural integrity
Magnetoresistance
Buffer layers
Silicon wafers
Magnetron sputtering
Substrates

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Smith, D., Modak, A. R., & Parkin, S. S. P. (1993). Structural characterization of thin Co/Cu superlattices. In B. T. Jonker, W. J. M. de Jonge, R. F. C. Farrow, C. Chappert, R. Clarke, & A. et al (Eds.), Materials Research Society Symposium Proceedings (Vol. 313, pp. 437-442). Pittsburgh, PA, United States: Publ by Materials Research Society.

Structural characterization of thin Co/Cu superlattices. / Smith, David; Modak, A. R.; Parkin, S. S P.

Materials Research Society Symposium Proceedings. ed. / B.T. Jonker; W.J.M. de Jonge; R.F.C. Farrow; C. Chappert; R. Clarke; al et al. Vol. 313 Pittsburgh, PA, United States : Publ by Materials Research Society, 1993. p. 437-442.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Smith, D, Modak, AR & Parkin, SSP 1993, Structural characterization of thin Co/Cu superlattices. in BT Jonker, WJM de Jonge, RFC Farrow, C Chappert, R Clarke & A et al (eds), Materials Research Society Symposium Proceedings. vol. 313, Publ by Materials Research Society, Pittsburgh, PA, United States, pp. 437-442, Proceedings of the 1993 MRS Spring Meeting on Magnetic Ultrathin Films, San Francisco, CA, USA, 4/12/93.
Smith D, Modak AR, Parkin SSP. Structural characterization of thin Co/Cu superlattices. In Jonker BT, de Jonge WJM, Farrow RFC, Chappert C, Clarke R, et al A, editors, Materials Research Society Symposium Proceedings. Vol. 313. Pittsburgh, PA, United States: Publ by Materials Research Society. 1993. p. 437-442
Smith, David ; Modak, A. R. ; Parkin, S. S P. / Structural characterization of thin Co/Cu superlattices. Materials Research Society Symposium Proceedings. editor / B.T. Jonker ; W.J.M. de Jonge ; R.F.C. Farrow ; C. Chappert ; R. Clarke ; al et al. Vol. 313 Pittsburgh, PA, United States : Publ by Materials Research Society, 1993. pp. 437-442
@inproceedings{300deac821f549c5b3ab6d661e3ef541,
title = "Structural characterization of thin Co/Cu superlattices",
abstract = "High-resolution electron microscopy has been used to characterize the microstructure of thin Co/Cu metallic multilayers grown on Si(100) substrates by dc magnetron sputtering. The nature of the buffer layer between the silicon wafer and the multilayer had a significant effect on the structural integrity of the multilayer. An increase in grain size was observed as a function of Cu layer thickness, with grain sizes typically being at least 3-4 times the bilayer period. A high degree of structural ordering was observed in superlattices comprised of thicker Cu layer with large grains often spanning the complete multilayer stack. Complementary magnetic measurements enabled the microstructure to be related to the oscillatory exchange coupling and large magnetoresistance exhibited by these thin magnetic films.",
author = "David Smith and Modak, {A. R.} and Parkin, {S. S P}",
year = "1993",
language = "English (US)",
isbn = "1558992111",
volume = "313",
pages = "437--442",
editor = "B.T. Jonker and {de Jonge}, W.J.M. and R.F.C. Farrow and C. Chappert and R. Clarke and {et al}, al",
booktitle = "Materials Research Society Symposium Proceedings",
publisher = "Publ by Materials Research Society",

}

TY - GEN

T1 - Structural characterization of thin Co/Cu superlattices

AU - Smith, David

AU - Modak, A. R.

AU - Parkin, S. S P

PY - 1993

Y1 - 1993

N2 - High-resolution electron microscopy has been used to characterize the microstructure of thin Co/Cu metallic multilayers grown on Si(100) substrates by dc magnetron sputtering. The nature of the buffer layer between the silicon wafer and the multilayer had a significant effect on the structural integrity of the multilayer. An increase in grain size was observed as a function of Cu layer thickness, with grain sizes typically being at least 3-4 times the bilayer period. A high degree of structural ordering was observed in superlattices comprised of thicker Cu layer with large grains often spanning the complete multilayer stack. Complementary magnetic measurements enabled the microstructure to be related to the oscillatory exchange coupling and large magnetoresistance exhibited by these thin magnetic films.

AB - High-resolution electron microscopy has been used to characterize the microstructure of thin Co/Cu metallic multilayers grown on Si(100) substrates by dc magnetron sputtering. The nature of the buffer layer between the silicon wafer and the multilayer had a significant effect on the structural integrity of the multilayer. An increase in grain size was observed as a function of Cu layer thickness, with grain sizes typically being at least 3-4 times the bilayer period. A high degree of structural ordering was observed in superlattices comprised of thicker Cu layer with large grains often spanning the complete multilayer stack. Complementary magnetic measurements enabled the microstructure to be related to the oscillatory exchange coupling and large magnetoresistance exhibited by these thin magnetic films.

UR - http://www.scopus.com/inward/record.url?scp=0027883468&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027883468&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027883468

SN - 1558992111

VL - 313

SP - 437

EP - 442

BT - Materials Research Society Symposium Proceedings

A2 - Jonker, B.T.

A2 - de Jonge, W.J.M.

A2 - Farrow, R.F.C.

A2 - Chappert, C.

A2 - Clarke, R.

A2 - et al, al

PB - Publ by Materials Research Society

CY - Pittsburgh, PA, United States

ER -