Structural characterization of thin Co/Cu superlattices

David Smith, A. R. Modak, S. S P Parkin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High-resolution electron microscopy has been used to characterize the microstructure of thin Co/Cu metallic multilayers grown on Si(100) substrates by dc magnetron sputtering. The nature of the buffer layer between the silicon wafer and the multilayer had a significant effect on the structural integrity of the multilayer. An increase in grain size was observed as a function of Cu layer thickness, with grain sizes typically being at least 3-4 times the bilayer period. A high degree of structural ordering was observed in superlattices comprised of thicker Cu layer with large grains often spanning the complete multilayer stack. Complementary magnetic measurements enabled the microstructure to be related to the oscillatory exchange coupling and large magnetoresistance exhibited by these thin magnetic films.

Original languageEnglish (US)
Title of host publicationMultilayers and Surfaces
PublisherPubl by Materials Research Society
Pages437-442
Number of pages6
ISBN (Print)1558992111, 9781558992115
DOIs
StatePublished - 1993
EventProceedings of the 1993 MRS Spring Meeting on Magnetic Ultrathin Films - San Francisco, CA, USA
Duration: Apr 12 1993Apr 16 1993

Publication series

NameMaterials Research Society Symposium Proceedings
Volume313
ISSN (Print)0272-9172

Other

OtherProceedings of the 1993 MRS Spring Meeting on Magnetic Ultrathin Films
CitySan Francisco, CA, USA
Period4/12/934/16/93

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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