STRUCTURAL CHANGES DURING TRANSIENT POST-ANNEALING OF PREANNEALED AND ARSENIC IMPLANTED POLYCRYSTALLINE SILICON FILMS.

Stephen Krause, S. R. Wilson, R. B. Gregory, W. M. Paulson, J. A. Leavitt, L. C. McIntyre, J. L. Seerveld, P. Stoss

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Polycrystalline silicon films were transient preannealed, As implanted, and transient post-annealed at peak temperatures up to 1250 degree C for times up to 17. 5 seconds. Structural changes occurring during post-annealing were examined by transmission electron microscopy. These results were correlated to Rutherford Backscattering and sheet resistance results. The grain size, which increased from 5-20 to 150-300 nm during preannealing, did not increase during post-annealing. During early stages of post-annealing, As diffused along grain boundaries and generated dislocation sources at grain boundary surfaces. Subsequently, as annealing progressed, a fine, As-rich cellular network structure propagated into the grains until the structure of an entire grain was transformed into a fine cellular network at the longest annealing times. Residual stresses in the film were relieved during formation of the network structure.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposia Proceedings
EditorsThomas O. Sedgwick, Thomas E. Seidel, Bor-Yeu Tsaur
PublisherMaterials Research Soc
Pages145-152
Number of pages8
ISBN (Print)0931837170
StatePublished - 1986

Publication series

NameMaterials Research Society Symposia Proceedings
Volume52
ISSN (Print)0272-9172

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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