Abstract
Stress is generally perceived to be detrimental for multicrystalline silicon (mc-Si), leading to dislocation multiplication during crystal growth and processing. Herein, we evaluate the role of stress as a driving force for dislocation density reduction in mc-Si. At high temperatures, close to the melting point (>0.8Tm), we observe that the application of stress as well as the relief of residual stress, can modify the density of pre-existing dislocations in as-grown mc-Si under certain conditions, leading to a net local reduction of dislocation density. (
Original language | English (US) |
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Pages (from-to) | 28-30 |
Number of pages | 3 |
Journal | Physica Status Solidi - Rapid Research Letters |
Volume | 5 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2011 |
Externally published | Yes |
Keywords
- 3-point bending
- Annealing
- Dislocation density
- Dislocations
- High temperature
- Si
- Stress
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics