Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy

S. A. Turnage, M. Rajagopalan, K. A. Darling, C. Kale, B. C. Hornbuckle, C. L. Williams, K. N. Solanki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of mechanical loading, particularly at dynamic strain rates, on nanocrystalline (NC) materials has eluded researchers owing to the inherent instability of the NC structure. However, a recently developed NC Cu-10 at.%Ta alloy has exhibited an ability to maintain a NC structure at temperatures up to 873 K. Here, NC Cu-10 at.%Ta is tested under compressive strain rates ranging from 10−3 s−1 up to 105 s−1 and at temperatures from 298 K up to 1073 K. Typical materials show a sharp increase in flow stress occurring around 103 s−1 as deformation mechanisms shift away from thermal activation mechanisms; however, at 298 K, NC Cu-10 at.%Ta observes only a limited increase in flow stress indicating that typical thermally activated mechanisms still apply up to strain rates of 105 s−1. Post deformation analyses indicate a shift from nucleation of full dislocations to increased nucleation of partial dislocations at 298 K. However, as temperature increases, thermal activation mechanisms give way to viscous effects and the high density of nucleated full dislocations leads to a dramatic increase in flow stress.

Original languageEnglish (US)
Title of host publicationDynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics
EditorsLeslie E. Lamberson
PublisherSpringer
Pages63-67
Number of pages5
ISBN (Print)9783030300203
DOIs
StatePublished - Jan 1 2020
EventSEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2019 - Reno, United States
Duration: Jun 3 2019Jun 6 2019

Publication series

NameConference Proceedings of the Society for Experimental Mechanics Series
ISSN (Print)2191-5644
ISSN (Electronic)2191-5652

Conference

ConferenceSEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2019
CountryUnited States
CityReno
Period6/3/196/6/19

Fingerprint

Plastic flow
Strain rate
Nucleation
Chemical activation
Nanocrystalline materials
Temperature
Hot Temperature

Keywords

  • Dynamic behavior
  • Flow stress upturn
  • Nanocrystalline
  • Stabilized
  • Strain rate

ASJC Scopus subject areas

  • Engineering(all)
  • Computational Mechanics
  • Mechanical Engineering

Cite this

Turnage, S. A., Rajagopalan, M., Darling, K. A., Kale, C., Hornbuckle, B. C., Williams, C. L., & Solanki, K. N. (2020). Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy. In L. E. Lamberson (Ed.), Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics (pp. 63-67). (Conference Proceedings of the Society for Experimental Mechanics Series). Springer. https://doi.org/10.1007/978-3-030-30021-0_11

Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy. / Turnage, S. A.; Rajagopalan, M.; Darling, K. A.; Kale, C.; Hornbuckle, B. C.; Williams, C. L.; Solanki, K. N.

Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics. ed. / Leslie E. Lamberson. Springer, 2020. p. 63-67 (Conference Proceedings of the Society for Experimental Mechanics Series).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Turnage, SA, Rajagopalan, M, Darling, KA, Kale, C, Hornbuckle, BC, Williams, CL & Solanki, KN 2020, Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy. in LE Lamberson (ed.), Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics. Conference Proceedings of the Society for Experimental Mechanics Series, Springer, pp. 63-67, SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2019, Reno, United States, 6/3/19. https://doi.org/10.1007/978-3-030-30021-0_11
Turnage SA, Rajagopalan M, Darling KA, Kale C, Hornbuckle BC, Williams CL et al. Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy. In Lamberson LE, editor, Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics. Springer. 2020. p. 63-67. (Conference Proceedings of the Society for Experimental Mechanics Series). https://doi.org/10.1007/978-3-030-30021-0_11
Turnage, S. A. ; Rajagopalan, M. ; Darling, K. A. ; Kale, C. ; Hornbuckle, B. C. ; Williams, C. L. ; Solanki, K. N. / Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy. Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics. editor / Leslie E. Lamberson. Springer, 2020. pp. 63-67 (Conference Proceedings of the Society for Experimental Mechanics Series).
@inproceedings{d51b363d495847c593ff18cea830dfe3,
title = "Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy",
abstract = "The effect of mechanical loading, particularly at dynamic strain rates, on nanocrystalline (NC) materials has eluded researchers owing to the inherent instability of the NC structure. However, a recently developed NC Cu-10 at.{\%}Ta alloy has exhibited an ability to maintain a NC structure at temperatures up to 873 K. Here, NC Cu-10 at.{\%}Ta is tested under compressive strain rates ranging from 10−3 s−1 up to 105 s−1 and at temperatures from 298 K up to 1073 K. Typical materials show a sharp increase in flow stress occurring around 103 s−1 as deformation mechanisms shift away from thermal activation mechanisms; however, at 298 K, NC Cu-10 at.{\%}Ta observes only a limited increase in flow stress indicating that typical thermally activated mechanisms still apply up to strain rates of 105 s−1. Post deformation analyses indicate a shift from nucleation of full dislocations to increased nucleation of partial dislocations at 298 K. However, as temperature increases, thermal activation mechanisms give way to viscous effects and the high density of nucleated full dislocations leads to a dramatic increase in flow stress.",
keywords = "Dynamic behavior, Flow stress upturn, Nanocrystalline, Stabilized, Strain rate",
author = "Turnage, {S. A.} and M. Rajagopalan and Darling, {K. A.} and C. Kale and Hornbuckle, {B. C.} and Williams, {C. L.} and Solanki, {K. N.}",
year = "2020",
month = "1",
day = "1",
doi = "10.1007/978-3-030-30021-0_11",
language = "English (US)",
isbn = "9783030300203",
series = "Conference Proceedings of the Society for Experimental Mechanics Series",
publisher = "Springer",
pages = "63--67",
editor = "Lamberson, {Leslie E.}",
booktitle = "Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics",

}

TY - GEN

T1 - Strain Rate Dependence of Stabilized, Nanocrystalline Cu Alloy

AU - Turnage, S. A.

AU - Rajagopalan, M.

AU - Darling, K. A.

AU - Kale, C.

AU - Hornbuckle, B. C.

AU - Williams, C. L.

AU - Solanki, K. N.

PY - 2020/1/1

Y1 - 2020/1/1

N2 - The effect of mechanical loading, particularly at dynamic strain rates, on nanocrystalline (NC) materials has eluded researchers owing to the inherent instability of the NC structure. However, a recently developed NC Cu-10 at.%Ta alloy has exhibited an ability to maintain a NC structure at temperatures up to 873 K. Here, NC Cu-10 at.%Ta is tested under compressive strain rates ranging from 10−3 s−1 up to 105 s−1 and at temperatures from 298 K up to 1073 K. Typical materials show a sharp increase in flow stress occurring around 103 s−1 as deformation mechanisms shift away from thermal activation mechanisms; however, at 298 K, NC Cu-10 at.%Ta observes only a limited increase in flow stress indicating that typical thermally activated mechanisms still apply up to strain rates of 105 s−1. Post deformation analyses indicate a shift from nucleation of full dislocations to increased nucleation of partial dislocations at 298 K. However, as temperature increases, thermal activation mechanisms give way to viscous effects and the high density of nucleated full dislocations leads to a dramatic increase in flow stress.

AB - The effect of mechanical loading, particularly at dynamic strain rates, on nanocrystalline (NC) materials has eluded researchers owing to the inherent instability of the NC structure. However, a recently developed NC Cu-10 at.%Ta alloy has exhibited an ability to maintain a NC structure at temperatures up to 873 K. Here, NC Cu-10 at.%Ta is tested under compressive strain rates ranging from 10−3 s−1 up to 105 s−1 and at temperatures from 298 K up to 1073 K. Typical materials show a sharp increase in flow stress occurring around 103 s−1 as deformation mechanisms shift away from thermal activation mechanisms; however, at 298 K, NC Cu-10 at.%Ta observes only a limited increase in flow stress indicating that typical thermally activated mechanisms still apply up to strain rates of 105 s−1. Post deformation analyses indicate a shift from nucleation of full dislocations to increased nucleation of partial dislocations at 298 K. However, as temperature increases, thermal activation mechanisms give way to viscous effects and the high density of nucleated full dislocations leads to a dramatic increase in flow stress.

KW - Dynamic behavior

KW - Flow stress upturn

KW - Nanocrystalline

KW - Stabilized

KW - Strain rate

UR - http://www.scopus.com/inward/record.url?scp=85077783171&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85077783171&partnerID=8YFLogxK

U2 - 10.1007/978-3-030-30021-0_11

DO - 10.1007/978-3-030-30021-0_11

M3 - Conference contribution

AN - SCOPUS:85077783171

SN - 9783030300203

T3 - Conference Proceedings of the Society for Experimental Mechanics Series

SP - 63

EP - 67

BT - Dynamic Behavior of Materials, Volume 1 - Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics

A2 - Lamberson, Leslie E.

PB - Springer

ER -