Abstract
High resolution Raman scattering measurements have been carried out on pulse and continuous-wave laser annealed silicon samples with various surface preparations. These included polished and ion-bombarded wafers, and saw-cut crystals. The pulse annealing treatments were carried out in ultrahigh vacuum and in air. The residual strain was inferred from the frequency shift of the first-order Raman active mode of Si, and was detectable in the range 10 -2-10-3 in all except the polished samples.
Original language | English (US) |
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Pages (from-to) | 785-787 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 40 |
Issue number | 9 |
DOIs | |
State | Published - 1982 |
Externally published | Yes |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)