Strain-facilitated process for the lift-off of a Si layer of less than 20 nm thickness

Lin Shao, Yuan Lin, J. G. Swadener, J. K. Lee, Q. X. Jia, Y. Q. Wang, M. Nastasi, Phillip E. Thompson, N. David Theodore, Terry Alford, J. W. Mayer, Peng Chen, S. S. Lau

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Physics & Astronomy