Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection

Jinjin Li, Bonnie L. Bennett, Lina Karam, Jeff S. Pettinato

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Solder ball height and substrate coplanarity inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height and substrate coplanarity inspection tools such as laser profiling, fringe projection, and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height and substrate coplanarity measurement method is needed for inspecting units undergoing assembly.

Original languageEnglish (US)
JournalIEEE Transactions on Automation Science and Engineering
DOIs
StateAccepted/In press - Mar 11 2015

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Stereo vision
Soldering alloys
Inspection
Substrates
Confocal microscopy
Lasers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection. / Li, Jinjin; Bennett, Bonnie L.; Karam, Lina; Pettinato, Jeff S.

In: IEEE Transactions on Automation Science and Engineering, 11.03.2015.

Research output: Contribution to journalArticle

@article{bd514c50a70949ddbfa55524cbe36f38,
title = "Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection",
abstract = "Solder ball height and substrate coplanarity inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height and substrate coplanarity inspection tools such as laser profiling, fringe projection, and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height and substrate coplanarity measurement method is needed for inspecting units undergoing assembly.",
author = "Jinjin Li and Bennett, {Bonnie L.} and Lina Karam and Pettinato, {Jeff S.}",
year = "2015",
month = "3",
day = "11",
doi = "10.1109/TASE.2015.2403836",
language = "English (US)",
journal = "IEEE Transactions on Automation Science and Engineering",
issn = "1545-5955",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection

AU - Li, Jinjin

AU - Bennett, Bonnie L.

AU - Karam, Lina

AU - Pettinato, Jeff S.

PY - 2015/3/11

Y1 - 2015/3/11

N2 - Solder ball height and substrate coplanarity inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height and substrate coplanarity inspection tools such as laser profiling, fringe projection, and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height and substrate coplanarity measurement method is needed for inspecting units undergoing assembly.

AB - Solder ball height and substrate coplanarity inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height and substrate coplanarity inspection tools such as laser profiling, fringe projection, and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height and substrate coplanarity measurement method is needed for inspecting units undergoing assembly.

UR - http://www.scopus.com/inward/record.url?scp=84924787524&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84924787524&partnerID=8YFLogxK

U2 - 10.1109/TASE.2015.2403836

DO - 10.1109/TASE.2015.2403836

M3 - Article

AN - SCOPUS:84924787524

JO - IEEE Transactions on Automation Science and Engineering

JF - IEEE Transactions on Automation Science and Engineering

SN - 1545-5955

ER -