Statistics of weak grain boundaries for spall damage in polycrystalline copper

L. Wayne; K. Krishnan; S. Digiacomo; N. Kovvali; Pedro Peralta; S. N. Luo; S. Greenfield; D. Byler; D. Paisley; K. J. McClellan; A. Koskelo; R. Dickerson

doi:10.1016/j.scriptamat.2010.08.003

Statistics of weak grain boundaries for spall damage in polycrystalline copper

L. Wayne, K. Krishnan, S. Digiacomo, N. Kovvali, Pedro Peralta, S. N. Luo, S. Greenfield, D. Byler, D. Paisley, K. J. McClellan, A. Koskelo, R. Dickerson

Research output: Contribution to journal › Article › peer-review

87 Scopus citations

Abstract

Correlations between spall damage and local microstructure were investigated using polycrystalline copper samples via laser-driven plate impacts at low pressures. Electron backscattering diffraction was used to relate the presence of porosity to microstructural features such as grain boundaries and triple points. Preferred void-nucleation sites were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that terminated twins and grain boundaries with misorientations between 25° and 50° are the preferred locations for intergranular damage localization.

Original language	English (US)
Pages (from-to)	1065-1068
Number of pages	4
Journal	Scripta Materialia
Volume	63
Issue number	11
DOIs	https://doi.org/10.1016/j.scriptamat.2010.08.003
State	Published - Nov 2010

Keywords

Copper
Electron backscattering diffraction (EBSD)
Grain boundaries
Misorientation
Spall

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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10.1016/j.scriptamat.2010.08.003

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@article{2571ae3dc5ae4ef4b927da316922f4ff,

title = "Statistics of weak grain boundaries for spall damage in polycrystalline copper",

abstract = "Correlations between spall damage and local microstructure were investigated using polycrystalline copper samples via laser-driven plate impacts at low pressures. Electron backscattering diffraction was used to relate the presence of porosity to microstructural features such as grain boundaries and triple points. Preferred void-nucleation sites were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that terminated twins and grain boundaries with misorientations between 25° and 50° are the preferred locations for intergranular damage localization.",

keywords = "Copper, Electron backscattering diffraction (EBSD), Grain boundaries, Misorientation, Spall",

author = "L. Wayne and K. Krishnan and S. Digiacomo and N. Kovvali and Pedro Peralta and Luo, {S. N.} and S. Greenfield and D. Byler and D. Paisley and McClellan, {K. J.} and A. Koskelo and R. Dickerson",

note = "Funding Information: This research work was funded by LANL under LDRD # 20060021DR, and by the Department of Energy, NNSA, under SSAA Grants # DE-FG52-06NA26169 and DE-FG52-10NA29653 . N. Kovvali was funded by AFOSR Grant FA95550-06-1-0309 . Eric Loomis, Pat Dickerson (LANL), Damian Swift (LLNL), David Wright, and Dallas Kingsbury (ASU) are thanked for their help during the various phases of the research work. Access to the TRIDENT Facility & Electron Microscopy Laboratory at LANL, as well as the Center for High Resolution Electron Microscopy and the Mechanical Testing Laboratory at ASU is gratefully acknowledged.",

year = "2010",

month = nov,

doi = "10.1016/j.scriptamat.2010.08.003",

language = "English (US)",

volume = "63",

pages = "1065--1068",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "11",

}

TY - JOUR

T1 - Statistics of weak grain boundaries for spall damage in polycrystalline copper

AU - Wayne, L.

AU - Krishnan, K.

AU - Digiacomo, S.

AU - Kovvali, N.

AU - Peralta, Pedro

AU - Luo, S. N.

AU - Greenfield, S.

AU - Byler, D.

AU - Paisley, D.

AU - McClellan, K. J.

AU - Koskelo, A.

AU - Dickerson, R.

N1 - Funding Information: This research work was funded by LANL under LDRD # 20060021DR, and by the Department of Energy, NNSA, under SSAA Grants # DE-FG52-06NA26169 and DE-FG52-10NA29653 . N. Kovvali was funded by AFOSR Grant FA95550-06-1-0309 . Eric Loomis, Pat Dickerson (LANL), Damian Swift (LLNL), David Wright, and Dallas Kingsbury (ASU) are thanked for their help during the various phases of the research work. Access to the TRIDENT Facility & Electron Microscopy Laboratory at LANL, as well as the Center for High Resolution Electron Microscopy and the Mechanical Testing Laboratory at ASU is gratefully acknowledged.

PY - 2010/11

Y1 - 2010/11

N2 - Correlations between spall damage and local microstructure were investigated using polycrystalline copper samples via laser-driven plate impacts at low pressures. Electron backscattering diffraction was used to relate the presence of porosity to microstructural features such as grain boundaries and triple points. Preferred void-nucleation sites were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that terminated twins and grain boundaries with misorientations between 25° and 50° are the preferred locations for intergranular damage localization.

AB - Correlations between spall damage and local microstructure were investigated using polycrystalline copper samples via laser-driven plate impacts at low pressures. Electron backscattering diffraction was used to relate the presence of porosity to microstructural features such as grain boundaries and triple points. Preferred void-nucleation sites were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that terminated twins and grain boundaries with misorientations between 25° and 50° are the preferred locations for intergranular damage localization.

KW - Copper

KW - Electron backscattering diffraction (EBSD)

KW - Grain boundaries

KW - Misorientation

KW - Spall

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EP - 1068

JO - Scripta Materialia

JF - Scripta Materialia

IS - 11

ER -

Statistics of weak grain boundaries for spall damage in polycrystalline copper

Abstract

Keywords

ASJC Scopus subject areas

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