TY - GEN
T1 - Statistical aging under dynamic voltage scaling
T2 - 34th Annual Custom Integrated Circuits Conference, CICC 2012
AU - Velamala, Jyothi B.
AU - Sutaria, Ketul
AU - Shimizu, Hirofumi
AU - Awano, Hiromitsu
AU - Sato, Takashi
AU - Cao, Yu
PY - 2012
Y1 - 2012
N2 - Aging mechanisms, such as Negative Bias Temperature Instability (NBTI), limit the lifetime of CMOS design. Recent NBTI data exhibits an excessive amount of randomness and fast recovery, which are difficult to be handled by conventional power-law model (tn). Such discrepancies further pose the challenge on long-term reliability prediction in real circuit operation. To overcome these barriers, this work (1) proposes a logarithmic model (log(t)) that is derived from the trapping/de-trapping assumptions; (2) practically explains the aging statistics and the non-monotonic behavior under dynamic voltage scaling (DVS); and (3) comprehensively validates the new model with 65nm silicon data. Compared to previous models, the new result captures the essential role of the recovery phase under DVS, reducing unnecessary guard-banding in reliability protection.
AB - Aging mechanisms, such as Negative Bias Temperature Instability (NBTI), limit the lifetime of CMOS design. Recent NBTI data exhibits an excessive amount of randomness and fast recovery, which are difficult to be handled by conventional power-law model (tn). Such discrepancies further pose the challenge on long-term reliability prediction in real circuit operation. To overcome these barriers, this work (1) proposes a logarithmic model (log(t)) that is derived from the trapping/de-trapping assumptions; (2) practically explains the aging statistics and the non-monotonic behavior under dynamic voltage scaling (DVS); and (3) comprehensively validates the new model with 65nm silicon data. Compared to previous models, the new result captures the essential role of the recovery phase under DVS, reducing unnecessary guard-banding in reliability protection.
UR - http://www.scopus.com/inward/record.url?scp=84869430767&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84869430767&partnerID=8YFLogxK
U2 - 10.1109/CICC.2012.6330572
DO - 10.1109/CICC.2012.6330572
M3 - Conference contribution
AN - SCOPUS:84869430767
SN - 9781467315555
T3 - Proceedings of the Custom Integrated Circuits Conference
BT - Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, CICC 2012
Y2 - 9 September 2012 through 12 September 2012
ER -