Abstract
Hybrid means heterogeneous integration of conventional electronics with other electronic components that could be fabricated using conventional thin-film transistor (TFT) process technology by additive printing. The original intent was driven by the growth of displays and photovoltaics, and later by area lighting. All are based on electronics distributed over a large surface area and can provide excellent electrical performance. However, when fabricated on glass, they are heavy, breakable, and restricted as to placement. Thus, fabrication on substrates such as plastic would overcome those limitations while delivering a quality product in a variety of interesting form factors at lower manufacturing cost.
| Original language | English (US) |
|---|---|
| Article number | 7110428 |
| Pages (from-to) | 491-496 |
| Number of pages | 6 |
| Journal | Proceedings of the IEEE |
| Volume | 103 |
| Issue number | 4 |
| DOIs | |
| State | Published - 2015 |
| Externally published | Yes |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Special issue on advanced flexible electronics for sensing applications [Scanning the Issue]. / Reuss, Robert H.; Raupp, Gregory; Gnade, Bruce E.
In: Proceedings of the IEEE, Vol. 103, No. 4, 7110428, 2015, p. 491-496.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Special issue on advanced flexible electronics for sensing applications [Scanning the Issue]
AU - Reuss, Robert H.
AU - Raupp, Gregory
AU - Gnade, Bruce E.
PY - 2015
Y1 - 2015
N2 - Hybrid means heterogeneous integration of conventional electronics with other electronic components that could be fabricated using conventional thin-film transistor (TFT) process technology by additive printing. The original intent was driven by the growth of displays and photovoltaics, and later by area lighting. All are based on electronics distributed over a large surface area and can provide excellent electrical performance. However, when fabricated on glass, they are heavy, breakable, and restricted as to placement. Thus, fabrication on substrates such as plastic would overcome those limitations while delivering a quality product in a variety of interesting form factors at lower manufacturing cost.
AB - Hybrid means heterogeneous integration of conventional electronics with other electronic components that could be fabricated using conventional thin-film transistor (TFT) process technology by additive printing. The original intent was driven by the growth of displays and photovoltaics, and later by area lighting. All are based on electronics distributed over a large surface area and can provide excellent electrical performance. However, when fabricated on glass, they are heavy, breakable, and restricted as to placement. Thus, fabrication on substrates such as plastic would overcome those limitations while delivering a quality product in a variety of interesting form factors at lower manufacturing cost.
UR - http://www.scopus.com/inward/record.url?scp=84930221578&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84930221578&partnerID=8YFLogxK
U2 - 10.1109/JPROC.2015.2414486
DO - 10.1109/JPROC.2015.2414486
M3 - Article
AN - SCOPUS:84930221578
VL - 103
SP - 491
EP - 496
JO - Proceedings of the IEEE
JF - Proceedings of the IEEE
SN - 0018-9219
IS - 4
M1 - 7110428
ER -