Spatial dynamics of VCSEL arrays

P. M. Goorjian, Cun-Zheng Ning, G. P. Agrawal

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Numerical simulations of the spatial dynamics of the light output of two-dimensional arrays of VCSELs are presented. The cases presented include square and circular arrays of nine elements. For both configurations the spacing between elements is varied to study the effects on the interaction between elements. In addition, the effects of index guiding on the supermodes of the arrays will be shown. It was found that, with only a small amount of index guiding, the interactions between elements of the VCSEL array are effectively eliminated for all spacings between elements. The time evolutions of the spatial profiles of the laser intensity and carrier density are obtained by solving the Effective Semiconductor Bloch-Maxwell equations by a finite-difference algorithm. The algorithm can handle devices with multiple active regions of any shapes or pattern. There is no a priori assumption about the type or number of modes.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsY. Arakawa, P. Blood, M. Osinski
Pages287-292
Number of pages6
Volume4283
DOIs
StatePublished - 2001
Externally publishedYes
EventPhysics and Simulation of Optoelectronic Devices IX - San Jose, CA, United States
Duration: Jan 22 2001Jan 26 2001

Other

OtherPhysics and Simulation of Optoelectronic Devices IX
CountryUnited States
CitySan Jose, CA
Period1/22/011/26/01

Keywords

  • Computational modelling
  • Laser arrays
  • Laser optics
  • Optoelectronics
  • Spatial dynamics
  • VCSELs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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  • Cite this

    Goorjian, P. M., Ning, C-Z., & Agrawal, G. P. (2001). Spatial dynamics of VCSEL arrays. In Y. Arakawa, P. Blood, & M. Osinski (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 4283, pp. 287-292) https://doi.org/10.1117/12.432576