TY - JOUR
T1 - Solvent Control of Surface Plasmon-Mediated Chemical Deposition of Au Nanoparticles from Alkylgold Phosphine Complexes
AU - Muhich, Christopher L.
AU - Qiu, Jingjing
AU - Holder, Aaron M.
AU - Wu, Yung Chien
AU - Weimer, Alan W.
AU - Wei, Wei David
AU - McElwee-White, Lisa
AU - Musgrave, Charles B.
N1 - Publisher Copyright:
© 2015 American Chemical Society.
PY - 2015/6/24
Y1 - 2015/6/24
N2 - (Figure presented) Bottom-up approaches to nanofabrication are of great interest because they can enable structural control while minimizing material waste and fabrication time. One new bottom-up nanofabrication method involves excitation of the surface plasmon resonance (SPR) of a Ag surface to drive deposition of sub-15 nm Au nanoparticles from MeAuPPh3. In this work we used density functional theory to investigate the role of the PPh3 ligands of the Au precursor and the effect of adsorbed solvent on the deposition process, and to elucidate the mechanism of Au nanoparticle deposition. In the absence of solvent, the calculated barrier to MeAuPPh3 dissociation on the bare surface is <20 kcal/mol, making it facile at room temperature. Once adsorbed on the surface, neighboring MeAu fragments undergo ethane elimination to produce Au adatoms that cluster into Au nanoparticles. However, if the sample is immersed in benzene, we predict that the monolayer of adsorbed solvent blocks the adsorption of MeAuPPh3 onto the Ag surface because the PPh3 ligand is large compared to the size of the exposed surface between adsorbed benzenes. Instead, the Au-P bond of MeAuPPh3 dissociates in solution (Ea = 38.5 kcal/mol) in the plasmon heated near-surface region followed by the adsorption of the MeAu fragment on Ag in the interstitial space of the benzene monolayer. The adsorbed benzene forces the Au precursor to react through the higher energy path of dissociation in solution rather than dissociatively adsorbing onto the bare surface. This requires a higher temperature if the reaction is to proceed at a reasonable rate and enables the control of deposition by the light induced SPR heating of the surface and nearby solution.
AB - (Figure presented) Bottom-up approaches to nanofabrication are of great interest because they can enable structural control while minimizing material waste and fabrication time. One new bottom-up nanofabrication method involves excitation of the surface plasmon resonance (SPR) of a Ag surface to drive deposition of sub-15 nm Au nanoparticles from MeAuPPh3. In this work we used density functional theory to investigate the role of the PPh3 ligands of the Au precursor and the effect of adsorbed solvent on the deposition process, and to elucidate the mechanism of Au nanoparticle deposition. In the absence of solvent, the calculated barrier to MeAuPPh3 dissociation on the bare surface is <20 kcal/mol, making it facile at room temperature. Once adsorbed on the surface, neighboring MeAu fragments undergo ethane elimination to produce Au adatoms that cluster into Au nanoparticles. However, if the sample is immersed in benzene, we predict that the monolayer of adsorbed solvent blocks the adsorption of MeAuPPh3 onto the Ag surface because the PPh3 ligand is large compared to the size of the exposed surface between adsorbed benzenes. Instead, the Au-P bond of MeAuPPh3 dissociates in solution (Ea = 38.5 kcal/mol) in the plasmon heated near-surface region followed by the adsorption of the MeAu fragment on Ag in the interstitial space of the benzene monolayer. The adsorbed benzene forces the Au precursor to react through the higher energy path of dissociation in solution rather than dissociatively adsorbing onto the bare surface. This requires a higher temperature if the reaction is to proceed at a reasonable rate and enables the control of deposition by the light induced SPR heating of the surface and nearby solution.
KW - bottom-up nanofabrication
KW - density functional theory
KW - organogold chemistry
KW - organometallic chemistry
KW - preferential molecular adsorption
KW - thermal decomposition
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U2 - 10.1021/acsami.5b01918
DO - 10.1021/acsami.5b01918
M3 - Article
AN - SCOPUS:84934947714
SN - 1944-8244
VL - 7
SP - 13384
EP - 13394
JO - ACS Applied Materials and Interfaces
JF - ACS Applied Materials and Interfaces
IS - 24
ER -