Solid-state electrochemical stamping of functional metallic nanostructures

Keng Hsu, Peter Schultz, Placid Ferreira, Nicholas Fang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

A new approach of directly patterning metal at nano-scale with excellent dimensional resolution and flexibility is introduced for fabrication of functional nano-structures. This technique is based on the solid-state electrochemical dissolution of a metallic substrate at its contact with a pre-patterned surface of a solid electrolyte tool, and the subsequent formation of the complimentary pattern on the metal substrate as the solid electrolyte etches through the metal layer. Our results demonstrate repeatable and high-fidelity patterning of metal structures with a wide dimension range (20μm to 50nm). As this process is carried out in ambient environment and does not require wet chemicals, its potential for use as a simple and yet high-throughput metal patterning technique offers a highly competitive approach to fabricating functional structures and devices such as chemical sensors and photonic devices.

Original languageEnglish (US)
Title of host publication2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007, Proceedings
Pages162-165
Number of pages4
DOIs
StatePublished - Dec 1 2007
Event2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007 - Hong Kong, China
Duration: Aug 2 2007Aug 5 2007

Publication series

Name2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007, Proceedings

Other

Other2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007
CountryChina
CityHong Kong
Period8/2/078/5/07

Keywords

  • Electrochemistry
  • Nanoimprint lithography
  • Nanophotonics
  • Solid state ionics
  • Surface enhanced raman spectroscopy

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

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