Physics & Astronomy
fillers
86%
thermal conductivity
68%
Biot number
62%
polymers
51%
composite materials
44%
thresholds
35%
matrices
24%
chips
23%
heat
19%
heat sinks
17%
packaging
15%
polyethylenes
13%
aluminum oxides
11%
ceramics
9%
conduction
9%
temperature dependence
9%
acoustics
8%
Engineering & Materials Science
Fillers
83%
Thermal conductivity
79%
Polymers
64%
Composite materials
51%
Spreaders
47%
Hot Temperature
33%
Heat sinks
19%
Polyethylenes
18%
Alumina
17%
Particle size
16%
Packaging
15%
Semiconductor materials
15%
Acoustics
14%
Temperature
7%
Chemical Compounds
Size Effect
100%
Biot Number
91%
Thermal Conductivity
83%
Filler
75%
Composite Material
43%
Heat
26%
Ceramic
13%
Semiconductor
13%
Resistance
11%