Abstract
In the next generation of semiconductor wafer fabrication facilities, decisions concerning material handling systems will be a major factor in initial facility cost, operational cost, production cycle times, and possibly product yield percentages. The wafers will increase in diameter to 300 mm and a new front opening unified pod (FOUP) has been designed to carry them, both increasing the weight of a production lot. This increase requires substantial automation for ergonomic and quality reasons. As a result, semiconductor manufacturers are asking, `What level of automation is financially justifiable?' Automation suppliers have stated that automation saves money, but have as yet not produced a sufficiently detailed financial analysis proving their premise. In this paper, both a fully automated and a manual material handling system are simulated and compared in a thorough cost analysis. Sensitivity analysis is performed on inflation rate, interest rate, die price, wafer start rate, and yield percentage to validate the results of the analyzes.
| Original language | English (US) |
|---|---|
| Title of host publication | Winter Simulation Conference Proceedings |
| Pages | 1510-1517 |
| Number of pages | 8 |
| Volume | 2 |
| State | Published - 2000 |
| Event | 2000 Winter Simulation Proceedings - Orlando, FL, USA Duration: Dec 10 2000 → Dec 13 2000 |
Other
| Other | 2000 Winter Simulation Proceedings |
|---|---|
| City | Orlando, FL, USA |
| Period | 12/10/00 → 12/13/00 |
ASJC Scopus subject areas
- Chemical Health and Safety
- Software
- Safety, Risk, Reliability and Quality
- Applied Mathematics
- Modeling and Simulation