Simulation-based cost modeling methodology for evaluation of interbay material handling in a semiconductor wafer fab

Shari Murray, Gerald T. Mackulak, John Fowler, Theron Colvin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Scopus citations

Abstract

In the next generation of semiconductor wafer fabrication facilities, decisions concerning material handling systems will be a major factor in initial facility cost, operational cost, production cycle times, and possibly product yield percentages. The wafers will increase in diameter to 300 mm and a new front opening unified pod (FOUP) has been designed to carry them, both increasing the weight of a production lot. This increase requires substantial automation for ergonomic and quality reasons. As a result, semiconductor manufacturers are asking, `What level of automation is financially justifiable?' Automation suppliers have stated that automation saves money, but have as yet not produced a sufficiently detailed financial analysis proving their premise. In this paper, both a fully automated and a manual material handling system are simulated and compared in a thorough cost analysis. Sensitivity analysis is performed on inflation rate, interest rate, die price, wafer start rate, and yield percentage to validate the results of the analyzes.

Original languageEnglish (US)
Title of host publicationWinter Simulation Conference Proceedings
Pages1510-1517
Number of pages8
Volume2
StatePublished - 2000
Event2000 Winter Simulation Proceedings - Orlando, FL, USA
Duration: Dec 10 2000Dec 13 2000

Other

Other2000 Winter Simulation Proceedings
CityOrlando, FL, USA
Period12/10/0012/13/00

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Software
  • Safety, Risk, Reliability and Quality
  • Applied Mathematics
  • Modeling and Simulation

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    Murray, S., Mackulak, G. T., Fowler, J., & Colvin, T. (2000). Simulation-based cost modeling methodology for evaluation of interbay material handling in a semiconductor wafer fab. In Winter Simulation Conference Proceedings (Vol. 2, pp. 1510-1517)