Simulating atomic-scale defects with atomic methods and extended finite elements

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Accomplishments - Bridging discontinuities between continuum and atomic models with XFEM. - Enrichment functions that represent defects in a simulation: • Dislocations modeled as strong discontinuities and singular fields. • Works well for anisotropic/complex materials. Challenges/Future work - Coupling with molecular dynamics to get better dislocation core energy. - Coupling with diffusion models - to model dislocations as sinks for dopants.

Original languageEnglish (US)
Title of host publicationIMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference
StatePublished - 2012
Event8th Annual IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference - Scottsdale/Fountain Hills, AZ, United States
Duration: Mar 5 2012Mar 8 2012

Other

Other8th Annual IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference
CountryUnited States
CityScottsdale/Fountain Hills, AZ
Period3/5/123/8/12

Fingerprint

Defects
Molecular dynamics
Doping (additives)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Oswald, J. (2012). Simulating atomic-scale defects with atomic methods and extended finite elements. In IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference

Simulating atomic-scale defects with atomic methods and extended finite elements. / Oswald, Jay.

IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference. 2012.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Oswald, J 2012, Simulating atomic-scale defects with atomic methods and extended finite elements. in IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference. 8th Annual IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference, Scottsdale/Fountain Hills, AZ, United States, 3/5/12.
Oswald J. Simulating atomic-scale defects with atomic methods and extended finite elements. In IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference. 2012
Oswald, Jay. / Simulating atomic-scale defects with atomic methods and extended finite elements. IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference. 2012.
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