Abstract
We present a complete silicon (Si) nano-fabrication process to provide controlled shapes of nanostructures over large-scale Si surface area by combining our novel solvent controlled silica nanosphere (SNS) spin-coating method with reactive ion etching. Our novel spin-coating method shows that the introduction of N, N-dimethyl-formamide solvent for SNS spin-coating can greatly enhance the uniformity of spin-coated 2-dimensional SNS layer and its coverage with significantly less sensitivity to deposition area. The enhanced quality and coverage of SNS provided excellent nano-patterning for diverse etching applications. With our SNS lithography, reactive ion etching (RIE) has been applied with fluorine (F) and chlorine (Cl) based gases to provide (1) controlled etching selectivity between SNS (SiO2) and Si substrate and (2) desired etching orientation depending on target shape of structure. Here we focus on the fabrication of Si nanopillar structures with various top diameters but fixed height which show significantly improved anti-reflection effect. In addition, computational optical modeling with rigorous coupled wave analysis (RCWA) shows that well-tapered nanocone structures can provide greatly reduced incident light angle dependence for surface reflection.
| Original language | English (US) |
|---|---|
| Title of host publication | 2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 2206-2208 |
| Number of pages | 3 |
| ISBN (Print) | 9781479943982 |
| DOIs | |
| State | Published - Oct 15 2014 |
| Event | 40th IEEE Photovoltaic Specialist Conference, PVSC 2014 - Denver, United States Duration: Jun 8 2014 → Jun 13 2014 |
Other
| Other | 40th IEEE Photovoltaic Specialist Conference, PVSC 2014 |
|---|---|
| Country | United States |
| City | Denver |
| Period | 6/8/14 → 6/13/14 |
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Keywords
- incident angle
- Nano-fabriation
- reactive ion etching
- rigorous coupled wave analysis
- silica nanosphere
- silicon
- surface reflection
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
Silicon nano-fabrication by using silica nanosphere lithography technique for enhanced light management. / Choi, Jea Young; Honsberg, Christiana.
2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 2206-2208 6925363.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Silicon nano-fabrication by using silica nanosphere lithography technique for enhanced light management
AU - Choi, Jea Young
AU - Honsberg, Christiana
PY - 2014/10/15
Y1 - 2014/10/15
N2 - We present a complete silicon (Si) nano-fabrication process to provide controlled shapes of nanostructures over large-scale Si surface area by combining our novel solvent controlled silica nanosphere (SNS) spin-coating method with reactive ion etching. Our novel spin-coating method shows that the introduction of N, N-dimethyl-formamide solvent for SNS spin-coating can greatly enhance the uniformity of spin-coated 2-dimensional SNS layer and its coverage with significantly less sensitivity to deposition area. The enhanced quality and coverage of SNS provided excellent nano-patterning for diverse etching applications. With our SNS lithography, reactive ion etching (RIE) has been applied with fluorine (F) and chlorine (Cl) based gases to provide (1) controlled etching selectivity between SNS (SiO2) and Si substrate and (2) desired etching orientation depending on target shape of structure. Here we focus on the fabrication of Si nanopillar structures with various top diameters but fixed height which show significantly improved anti-reflection effect. In addition, computational optical modeling with rigorous coupled wave analysis (RCWA) shows that well-tapered nanocone structures can provide greatly reduced incident light angle dependence for surface reflection.
AB - We present a complete silicon (Si) nano-fabrication process to provide controlled shapes of nanostructures over large-scale Si surface area by combining our novel solvent controlled silica nanosphere (SNS) spin-coating method with reactive ion etching. Our novel spin-coating method shows that the introduction of N, N-dimethyl-formamide solvent for SNS spin-coating can greatly enhance the uniformity of spin-coated 2-dimensional SNS layer and its coverage with significantly less sensitivity to deposition area. The enhanced quality and coverage of SNS provided excellent nano-patterning for diverse etching applications. With our SNS lithography, reactive ion etching (RIE) has been applied with fluorine (F) and chlorine (Cl) based gases to provide (1) controlled etching selectivity between SNS (SiO2) and Si substrate and (2) desired etching orientation depending on target shape of structure. Here we focus on the fabrication of Si nanopillar structures with various top diameters but fixed height which show significantly improved anti-reflection effect. In addition, computational optical modeling with rigorous coupled wave analysis (RCWA) shows that well-tapered nanocone structures can provide greatly reduced incident light angle dependence for surface reflection.
KW - incident angle
KW - Nano-fabriation
KW - reactive ion etching
KW - rigorous coupled wave analysis
KW - silica nanosphere
KW - silicon
KW - surface reflection
UR - http://www.scopus.com/inward/record.url?scp=84912061233&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84912061233&partnerID=8YFLogxK
U2 - 10.1109/PVSC.2014.6925363
DO - 10.1109/PVSC.2014.6925363
M3 - Conference contribution
AN - SCOPUS:84912061233
SN - 9781479943982
SP - 2206
EP - 2208
BT - 2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
ER -