Signature analysis for leakage current wave forms of polluted insulators

George G. Karady, Felix Amarh

Research output: Chapter in Book/Report/Conference proceedingChapter

17 Scopus citations

Abstract

Previous researchers have shown, using FFT spectrum analyzers, that arcing causes a significant increase in the third harmonic content of the leakage current of polluted insulators. This paper investigates the feasibility of using modern high resolution digital spectral analysis methods to obtain better spectral estimates. Techniques discussed include the classical periodogram, correlogram, autoregressive (AR) and autoregressive-moving average (ARMA) methods. The leakage current was continuously acquired and stored (for about 30 mins) during flashover tests. The analog waveform was then digitized off-line and the digitized samples used to compute the power spectral density (PSD). It was observed that the relative magnitudes of the odd harmonics in the leakage current increase with increase in arcing intensity. In particular the third harmonic PSD increased from almost zero at the start of the experiment to about 20% of the fundamental frequency just prior to flashover.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Power Engineering Society Transmission and Distribution Conference
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages806-811
Number of pages6
Volume2
StatePublished - 1999
EventProceedings of the 1999 IEEE/PES Transmission and Distribution Conference - A Vision Into the 21st Century - New Orleans, LA, USA
Duration: Apr 11 1999May 16 1999

Other

OtherProceedings of the 1999 IEEE/PES Transmission and Distribution Conference - A Vision Into the 21st Century
CityNew Orleans, LA, USA
Period4/11/995/16/99

ASJC Scopus subject areas

  • Energy(all)
  • Engineering(all)

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  • Cite this

    Karady, G. G., & Amarh, F. (1999). Signature analysis for leakage current wave forms of polluted insulators. In Proceedings of the IEEE Power Engineering Society Transmission and Distribution Conference (Vol. 2, pp. 806-811). IEEE.