Seamless Test of Digital Components in Mixed-Signal Paths

Sule Ozev, Ismet Bayraktaroglu, Alex Orailoglu

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

The semiconductor device testing methodology based on the testing of digital components in mixed-signal paths is discussed. The defined digital testing approach for digital modules is based on the propagation of test inputs and responses through a path containing analog signals. The novel functional-interface mechanism for seamless test propagation across the analog to digital (A/D) divide in mixed-signal silicon-on-chips (SoCs) reduces the test application overhead from test points and buses. The methodology for computing the fault coverage and the effect of noise on the obtained fault coverage value are also discussed.

Original languageEnglish (US)
Pages (from-to)44-55
Number of pages12
JournalIEEE Design and Test of Computers
Volume21
Issue number1
DOIs
StatePublished - Jan 2004
Externally publishedYes

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Semiconductor device testing
Testing
Silicon

ASJC Scopus subject areas

  • Hardware and Architecture

Cite this

Seamless Test of Digital Components in Mixed-Signal Paths. / Ozev, Sule; Bayraktaroglu, Ismet; Orailoglu, Alex.

In: IEEE Design and Test of Computers, Vol. 21, No. 1, 01.2004, p. 44-55.

Research output: Contribution to journalArticle

Ozev, Sule ; Bayraktaroglu, Ismet ; Orailoglu, Alex. / Seamless Test of Digital Components in Mixed-Signal Paths. In: IEEE Design and Test of Computers. 2004 ; Vol. 21, No. 1. pp. 44-55.
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