Role of tantalum concentration, processing temperature, and strain-rate on the mechanical behavior of copper-tantalum alloys

S. Srinivasan, S. Sharma, S. Turnage, B. C. Hornbuckle, C. Kale, K. A. Darling, K. Solanki

Research output: Contribution to journalArticlepeer-review

Abstract

Microstructural instability in traditional nanocrystalline metals limits the understanding of the fundamental effect of grain size on mechanical behavior under extreme environmental conditions such as high temperature and loading rates. In this work, the interplay between Ta concentrations and processing temperature on the resulting microstructure of a powder processed, fully dense Cu-Ta alloy along with their tensile and compressive behavior at different strain rates are investigated to probe the possibility of manipulating or tuning microstructurally dependent parameters to control the flow-stress upturn phenomenon. Consequently, the results reveal that there is a crucial length scale, i.e., small grain size and appropriate cluster spacing, below which such upturn is damped out. The observation of changes in flow stress upturn behavior is consistent with the observed changes in measured high-rate plasticity, which enhances below the critical length scale. Furthermore, tension-compression asymmetry also tends to be suppressed in nanocrystalline Cu-Ta alloys, while it becomes evident as the grain size increases to an ultrafine regime. Overall, this work presents a systematic approach to control or engineer reduced high strain rate flow stress upturn behavior in metallic alloys, for high-rate applications.

Original languageEnglish (US)
Article number116706
JournalActa Materialia
Volume208
DOIs
StatePublished - Apr 15 2021

Keywords

  • Flow stress upturn
  • Microstructure
  • Nanocrystalline
  • Strain rate

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

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