Robust automatic void detection in solder balls

Asaad F. Said, Bonnie L. Bennett, Lina Karam, Jeff Pettinato

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

Voids in solder balls can cause board failures. The detection and assessment of voids in solder balls can help in reducing board yield issues caused by incorrect scrapping and rework. X-ray imaging machines make voids visible to the operator for manual inspection. Some existing x-ray inspection systems have void detection algorithms that require the use of intensive manual tuning operations that are time consuming, and inaccurate due to the inability to examine balls overshadowed with other components. In this paper, a robust automatic void detection algorithm is proposed. The proposed method is able to detect voids with different sizes inside the solder balls, including the ones that are overshadowed by board components and under different brightness conditions. Results show that the proposed method achieves a correlation squared in the range of 91% to 97 % with ground truth data from a 3D x-ray scan. The proposed algorithm is fully automated and benefits the manufacturing process by reducing operator effort and by providing a cost effective solution to improve output quality.

Original languageEnglish (US)
Title of host publicationICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings
Pages1650-1653
Number of pages4
DOIs
StatePublished - 2010
Event2010 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2010 - Dallas, TX, United States
Duration: Mar 14 2010Mar 19 2010

Other

Other2010 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2010
CountryUnited States
CityDallas, TX
Period3/14/103/19/10

Fingerprint

Soldering alloys
X rays
Inspection
Luminance
Tuning
Imaging techniques
Costs

Keywords

  • BGA
  • Features extraction
  • Segmentation
  • Voids detection

ASJC Scopus subject areas

  • Signal Processing
  • Software
  • Electrical and Electronic Engineering

Cite this

Said, A. F., Bennett, B. L., Karam, L., & Pettinato, J. (2010). Robust automatic void detection in solder balls. In ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings (pp. 1650-1653). [5495524] https://doi.org/10.1109/ICASSP.2010.5495524

Robust automatic void detection in solder balls. / Said, Asaad F.; Bennett, Bonnie L.; Karam, Lina; Pettinato, Jeff.

ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings. 2010. p. 1650-1653 5495524.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Said, AF, Bennett, BL, Karam, L & Pettinato, J 2010, Robust automatic void detection in solder balls. in ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings., 5495524, pp. 1650-1653, 2010 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2010, Dallas, TX, United States, 3/14/10. https://doi.org/10.1109/ICASSP.2010.5495524
Said AF, Bennett BL, Karam L, Pettinato J. Robust automatic void detection in solder balls. In ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings. 2010. p. 1650-1653. 5495524 https://doi.org/10.1109/ICASSP.2010.5495524
Said, Asaad F. ; Bennett, Bonnie L. ; Karam, Lina ; Pettinato, Jeff. / Robust automatic void detection in solder balls. ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings. 2010. pp. 1650-1653
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