RLC signal integrity analysis of high-speed global interconnects

X. Huang, Yu Cao, D. Sylvester, S. Lin, T. J. King, C. Hu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

33 Scopus citations

Abstract

Inductive and capacitive coupling effects for high-speed global interconnects are studied via simulation. The impact of inductive coupling on delay and noise is found to be comparable to capacitive effects in high-speed buses. The results indicate that current-return paths are not strictly bounded by wide VDD/GND lines, so that inductive coupling is only partially eliminated by using shield wires. Shielding strategies for noise- and delay-sensitive nets is proposed, considering worst-case switching patterns.

Original languageEnglish (US)
Title of host publicationTechnical Digest - International Electron Devices Meeting
Pages731-733
Number of pages3
StatePublished - 2000
Externally publishedYes
Event2000 IEEE International Electron Devices Meeting - San Francisco, CA, United States
Duration: Dec 10 2000Dec 13 2000

Other

Other2000 IEEE International Electron Devices Meeting
CountryUnited States
CitySan Francisco, CA
Period12/10/0012/13/00

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Huang, X., Cao, Y., Sylvester, D., Lin, S., King, T. J., & Hu, C. (2000). RLC signal integrity analysis of high-speed global interconnects. In Technical Digest - International Electron Devices Meeting (pp. 731-733)