Reliability Testing by Mechanical and Electrical Characterization of Flexible and Stretchable Interconnect Materials

Mayukh Nandy, Yanze Wu, Todd Houghton, Hongbin Yu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Flexible interconnects are mainly characterized by their ability to bend, fold, compress or stretch while maintaining their electrical stability and mechanical durability even under considerable deformations. A trade-off between the mechanical and electrical properties has always put researchers in a dilemma while choosing interconnects for potential applications in flexible and stretchable electronics. In this paper, we present bending and stretch testing methods for emerging interconnect materials such as copper coated polyimide, aluminum coated PET and copper coated PET. The materials under test are scanned using Optical and Scanning Electron Microscope to scrutinize creases, cracks, and other deformations. Electrical characterization is performed using a precision 2-point DC probe and four-point sheet resistance probe. These results are compared to a PDMS-silver conducting composite interconnect subject to similar test conditions.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1744-1748
Number of pages5
ISBN (Electronic)9780738145235
DOIs
StatePublished - 2021
Externally publishedYes
Event71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States
Duration: Jun 1 2021Jul 4 2021

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2021-June
ISSN (Print)0569-5503

Conference

Conference71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/TerritoryUnited States
CityVirtual, Online
Period6/1/217/4/21

Keywords

  • Composite materials
  • Conducting materials
  • Flexible electronics
  • Interconnect
  • Materials Reliability
  • Polymers
  • Reliability testing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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