TY - GEN
T1 - Reliability Testing by Mechanical and Electrical Characterization of Flexible and Stretchable Interconnect Materials
AU - Nandy, Mayukh
AU - Wu, Yanze
AU - Houghton, Todd
AU - Yu, Hongbin
N1 - Funding Information:
Funding was provided by U.S. Government Misc. Agencies (Grant No.
Publisher Copyright:
© 2021 IEEE
PY - 2021
Y1 - 2021
N2 - Flexible interconnects are mainly characterized by their ability to bend, fold, compress or stretch while maintaining their electrical stability and mechanical durability even under considerable deformations. A trade-off between the mechanical and electrical properties has always put researchers in a dilemma while choosing interconnects for potential applications in flexible and stretchable electronics. In this paper, we present bending and stretch testing methods for emerging interconnect materials such as copper coated polyimide, aluminum coated PET and copper coated PET. The materials under test are scanned using Optical and Scanning Electron Microscope to scrutinize creases, cracks, and other deformations. Electrical characterization is performed using a precision 2-point DC probe and four-point sheet resistance probe. These results are compared to a PDMS-silver conducting composite interconnect subject to similar test conditions.
AB - Flexible interconnects are mainly characterized by their ability to bend, fold, compress or stretch while maintaining their electrical stability and mechanical durability even under considerable deformations. A trade-off between the mechanical and electrical properties has always put researchers in a dilemma while choosing interconnects for potential applications in flexible and stretchable electronics. In this paper, we present bending and stretch testing methods for emerging interconnect materials such as copper coated polyimide, aluminum coated PET and copper coated PET. The materials under test are scanned using Optical and Scanning Electron Microscope to scrutinize creases, cracks, and other deformations. Electrical characterization is performed using a precision 2-point DC probe and four-point sheet resistance probe. These results are compared to a PDMS-silver conducting composite interconnect subject to similar test conditions.
KW - Composite materials
KW - Conducting materials
KW - Flexible electronics
KW - Interconnect
KW - Materials Reliability
KW - Polymers
KW - Reliability testing
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U2 - 10.1109/ECTC32696.2021.00275
DO - 10.1109/ECTC32696.2021.00275
M3 - Conference contribution
AN - SCOPUS:85124674691
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1744
EP - 1748
BT - Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 71st IEEE Electronic Components and Technology Conference, ECTC 2021
Y2 - 1 June 2021 through 4 July 2021
ER -