Reliability and Manufacturing Demonstrations of a New Photovoltaic Module Architecture and Streamlined Approach to Encpasulation

Samuel Ellis, Larry Maple, Tushar Shimpi, Ashwini Pavgi, Govindasamy Tamizhmani, Walajabad Sampth, Kurt Barth

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

New photovoltaic module encapsulation technology is under development that can help achieve Department of Energy SunShot utility solar cost goals of 0.03/kWh by lowering manufacturing cost and improving module reliability. Vacuum lamination-based encapsulation can take up to 20 minutes to complete, has high operating cost, and requires a large factory footprint. Current encapsulation architectures are the source of several module degradation issues. A new module architecture and streamlined process is demonstrated to show under 30 second cycle time for each process and improved reliability. Modules are fabricated on industry ready tools and undergo several accelerated tests.

Original languageEnglish (US)
Title of host publication2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1504-1506
Number of pages3
ISBN (Electronic)9781665419222
DOIs
StatePublished - Jun 20 2021
Event48th IEEE Photovoltaic Specialists Conference, PVSC 2021 - Fort Lauderdale, United States
Duration: Jun 20 2021Jun 25 2021

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371

Conference

Conference48th IEEE Photovoltaic Specialists Conference, PVSC 2021
Country/TerritoryUnited States
CityFort Lauderdale
Period6/20/216/25/21

Keywords

  • encapsulation
  • manufacturing
  • module
  • reliability

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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