Reliability analysis of electronic devices with multiple competing failure modes involving performance aging degradation

Wei Huang, Ronald Askin

Research output: Contribution to journalArticle

96 Citations (Scopus)

Abstract

This paper presents an extension of reliability analysis of electronic devices with multiple competing failure modes involving performance aging degradation. The probability that a product fails on a specific mode is derived. Using this probability, the dominant failure mode on the product can be predicted. A practical example is presented to analyze an electronic device with two kinds of major failure modes-solder/Cu pad interface fracture (a catastrophic failure) and light intensity degradation (a degradation failure). Reliability modeling of an individual failure mode and device reliability analysis is presented and results are discussed.

Original languageEnglish (US)
Pages (from-to)241-254
Number of pages14
JournalQuality and Reliability Engineering International
Volume19
Issue number3
DOIs
StatePublished - May 2003

Fingerprint

Reliability analysis
Failure modes
Aging of materials
Degradation
Soldering alloys

Keywords

  • Competing failure modes
  • Electronic devices
  • Performance aging degradation
  • Reliability
  • Weibull distribution

ASJC Scopus subject areas

  • Engineering (miscellaneous)
  • Management Science and Operations Research

Cite this

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