Release etch modeling analysis and the use of Laser Scanning Microscopy for etch time prediction of micromachined structures

George Matamis, Bishnu Gogoi, David Monk, Andrew McNeil, Veronica Burrows

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

An alternative non-destructive analysis method using Laser Scanning Microscopy (LSM) was used to study etch release distances in MEMS pressure sensors. The LSM method eliminates sample preparation and is easy to implement in a MEMS manufacturing environment. In this study, various diaphragm structures were etched using a highly concentrated HF based solution. Experimental etch data were obtained for both SiO 2 and PSG films under these various structures. Both the height and the width of the sacrificial layer port/channel had a significant effect on etch rate for both films. As expected, a non-linear etch rate was obtained for both SiO 2 and PSG films. Since the HF concentration changes over time in a manufacturing bath process, careful selection of processing time is required in order to fully release MEMS structures. Future theoretical modeling with the assistance of experimental data obtained in this study is being pursued to strengthen past work done by Eaton et al., Monk et al., and Liu et al.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages267-278
Number of pages12
Volume4174
DOIs
StatePublished - 2000
EventMicromachining and Microfabrication Process Technology VI - Santa Clara, CA, USA
Duration: Dec 18 2000Dec 20 2000

Other

OtherMicromachining and Microfabrication Process Technology VI
CitySanta Clara, CA, USA
Period12/18/0012/20/00

Fingerprint

microelectromechanical systems
MEMS
Microscopic examination
microscopy
Scanning
scanning
Lasers
manufacturing
predictions
lasers
Pressure sensors
diaphragms
pressure sensors
Diaphragms
baths
preparation
Processing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Matamis, G., Gogoi, B., Monk, D., McNeil, A., & Burrows, V. (2000). Release etch modeling analysis and the use of Laser Scanning Microscopy for etch time prediction of micromachined structures. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 4174, pp. 267-278). Society of Photo-Optical Instrumentation Engineers. https://doi.org/10.1117/12.396442

Release etch modeling analysis and the use of Laser Scanning Microscopy for etch time prediction of micromachined structures. / Matamis, George; Gogoi, Bishnu; Monk, David; McNeil, Andrew; Burrows, Veronica.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 4174 Society of Photo-Optical Instrumentation Engineers, 2000. p. 267-278.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Matamis, G, Gogoi, B, Monk, D, McNeil, A & Burrows, V 2000, Release etch modeling analysis and the use of Laser Scanning Microscopy for etch time prediction of micromachined structures. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 4174, Society of Photo-Optical Instrumentation Engineers, pp. 267-278, Micromachining and Microfabrication Process Technology VI, Santa Clara, CA, USA, 12/18/00. https://doi.org/10.1117/12.396442
Matamis G, Gogoi B, Monk D, McNeil A, Burrows V. Release etch modeling analysis and the use of Laser Scanning Microscopy for etch time prediction of micromachined structures. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 4174. Society of Photo-Optical Instrumentation Engineers. 2000. p. 267-278 https://doi.org/10.1117/12.396442
Matamis, George ; Gogoi, Bishnu ; Monk, David ; McNeil, Andrew ; Burrows, Veronica. / Release etch modeling analysis and the use of Laser Scanning Microscopy for etch time prediction of micromachined structures. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 4174 Society of Photo-Optical Instrumentation Engineers, 2000. pp. 267-278
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