Reduction of the thermal impedance of vertical-cavity surface-emitting lasers after integration with copper substrates

D. L. Mathine; H. Nejad; David Allee; R. Droopad; G. N. Maracas

doi:10.1063/1.118140

Reduction of the thermal impedance of vertical-cavity surface-emitting lasers after integration with copper substrates

D. L. Mathine, H. Nejad, David Allee, R. Droopad, G. N. Maracas

IAFSE-ECEE: Electrical Engineering

Research output: Contribution to journal › Article › peer-review

27 Scopus citations

Abstract

Vertical-cavity surface-emitting lasers (VCSELs) have been transferred from their original GaAs substrates to Cu substrates and continuous wave operation has been obtained on the VCSELs after epitaxial transfer. The resultant measurements show a doubling of the output power and a 20% reduction in the thermal impedance. Increased optical power is explained by improved thermal heat sinking as measured from the lasing spectra of horizontal-cavity edge-emitting lasers fabricated from the same VCSEL material.

Original language	English (US)
Pages (from-to)	463-464
Number of pages	2
Journal	Applied Physics Letters
Volume	69
Issue number	4
DOIs	https://doi.org/10.1063/1.118140
State	Published - Jul 22 1996

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

Access to Document

10.1063/1.118140

Cite this

@article{471014fea50741ca8d52ef0327bb3055,

title = "Reduction of the thermal impedance of vertical-cavity surface-emitting lasers after integration with copper substrates",

abstract = "Vertical-cavity surface-emitting lasers (VCSELs) have been transferred from their original GaAs substrates to Cu substrates and continuous wave operation has been obtained on the VCSELs after epitaxial transfer. The resultant measurements show a doubling of the output power and a 20% reduction in the thermal impedance. Increased optical power is explained by improved thermal heat sinking as measured from the lasing spectra of horizontal-cavity edge-emitting lasers fabricated from the same VCSEL material.",

author = "Mathine, {D. L.} and H. Nejad and David Allee and R. Droopad and Maracas, {G. N.}",

year = "1996",

month = jul,

day = "22",

doi = "10.1063/1.118140",

language = "English (US)",

volume = "69",

pages = "463--464",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics Publising LLC",

number = "4",

}

TY - JOUR

T1 - Reduction of the thermal impedance of vertical-cavity surface-emitting lasers after integration with copper substrates

AU - Mathine, D. L.

AU - Nejad, H.

AU - Allee, David

AU - Droopad, R.

AU - Maracas, G. N.

PY - 1996/7/22

Y1 - 1996/7/22

N2 - Vertical-cavity surface-emitting lasers (VCSELs) have been transferred from their original GaAs substrates to Cu substrates and continuous wave operation has been obtained on the VCSELs after epitaxial transfer. The resultant measurements show a doubling of the output power and a 20% reduction in the thermal impedance. Increased optical power is explained by improved thermal heat sinking as measured from the lasing spectra of horizontal-cavity edge-emitting lasers fabricated from the same VCSEL material.

AB - Vertical-cavity surface-emitting lasers (VCSELs) have been transferred from their original GaAs substrates to Cu substrates and continuous wave operation has been obtained on the VCSELs after epitaxial transfer. The resultant measurements show a doubling of the output power and a 20% reduction in the thermal impedance. Increased optical power is explained by improved thermal heat sinking as measured from the lasing spectra of horizontal-cavity edge-emitting lasers fabricated from the same VCSEL material.

UR - http://www.scopus.com/inward/record.url?scp=0030195761&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030195761&partnerID=8YFLogxK

U2 - 10.1063/1.118140

DO - 10.1063/1.118140

M3 - Article

AN - SCOPUS:0030195761

VL - 69

SP - 463

EP - 464

JO - Applied Physics Letters

JF - Applied Physics Letters

SN - 0003-6951

IS - 4

ER -

Reduction of the thermal impedance of vertical-cavity surface-emitting lasers after integration with copper substrates

Abstract

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this