Real-time monitoring of envelope assemblies

Harvey Bryan, Marcus Myers

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper will explore how we can move from whole building energy usage data to that which can now include component level energy data (i.e., envelope assemblies). This paper will discuss a recent installation in a new campus building of a distributed low cost data acquisition system that can monitor at the component level. Five different wall/roof orientations were selected to have thermocouple sensors placed through the building envelope assembly. All these sensors will be connected to a programmable logic controller which will be integrated with a campus wide website. This system will not only become the new campus standard but will also have an enormous educational benefit to students who use this website.

Original languageEnglish (US)
Title of host publication30th International PLEA Conference
Subtitle of host publicationSustainable Habitat for Developing Societies: Choosing the Way Forward - Proceedings
EditorsRajan Rawal, Sanyogita Manu, Nirmala Khadpekar
PublisherCEPT University Press
Pages56-59
Number of pages4
ISBN (Electronic)9789383184033
StatePublished - 2014
Event30th International on Passive and Low Energy Architecture Conference - Sustainable Habitat for Developing Societies: Choosing the Way Forward, PLEA 2014 - Ahmedabad, India
Duration: Dec 16 2014Dec 18 2014

Publication series

Name30th International PLEA Conference: Sustainable Habitat for Developing Societies: Choosing the Way Forward - Proceedings
Volume4

Conference

Conference30th International on Passive and Low Energy Architecture Conference - Sustainable Habitat for Developing Societies: Choosing the Way Forward, PLEA 2014
CountryIndia
CityAhmedabad
Period12/16/1412/18/14

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Renewable Energy, Sustainability and the Environment

Fingerprint Dive into the research topics of 'Real-time monitoring of envelope assemblies'. Together they form a unique fingerprint.

Cite this