Reactive silver ink as front contacts for high efficiency silicon heterojunction solar cells

April M. Jeffries, Avinash Mamidanna, Laura Ding, Owen Hildreth, Mariana Bertoni

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Low-resistance Ohmic contacts formed at low temperatures expand photovoltaic device opportunities to include thermally sensitive layers while reducing thermal budget during fabrication. Silicon heterojunction solar cells cannot be processed over ∼200°C because of temperature-induced degradation of surface passivation provided by hydrogenated amorphous silicon. Efficiencies of these cells are limited by high series resistance, which primarily arises from the use of relatively high-resistivity silver paste contacts that are formed at low-temperature. We report the formation of highly conductive contacts by drop-on-demand printing of reactive silver inks at low temperatures between 50 and 110°C, resulting in resistivities approaching that of bulk silver. Reactive silver ink printed as a front grid on a silicon heterojunction solar cell resulted in a cell series resistance of 1.8Ω cm2 compared to 1.1Ω cm2 for a cell screen printed with low-temperature silver paste. These results show that, before optimization, reactive silver ink contacts perform comparably to pastes that have been custom developed and commercialized for this specific application.

Original languageEnglish (US)
Title of host publication2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-5
Number of pages5
ISBN (Electronic)9781509056057
DOIs
StatePublished - May 25 2018
Event44th IEEE Photovoltaic Specialist Conference, PVSC 2017 - Washington, United States
Duration: Jun 25 2017Jun 30 2017

Other

Other44th IEEE Photovoltaic Specialist Conference, PVSC 2017
CountryUnited States
CityWashington
Period6/25/176/30/17

Fingerprint

Silicon
Silver
Ink
Heterojunctions
Solar cells
Ointments
Temperature
Ohmic contacts
Amorphous silicon
Passivation
Printing
Fabrication
Degradation

Keywords

  • Contacts
  • Drop-on-demand printing
  • Metallization
  • Silver

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Jeffries, A. M., Mamidanna, A., Ding, L., Hildreth, O., & Bertoni, M. (2018). Reactive silver ink as front contacts for high efficiency silicon heterojunction solar cells. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017 (pp. 1-5). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2017.8366444

Reactive silver ink as front contacts for high efficiency silicon heterojunction solar cells. / Jeffries, April M.; Mamidanna, Avinash; Ding, Laura; Hildreth, Owen; Bertoni, Mariana.

2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-5.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jeffries, AM, Mamidanna, A, Ding, L, Hildreth, O & Bertoni, M 2018, Reactive silver ink as front contacts for high efficiency silicon heterojunction solar cells. in 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., pp. 1-5, 44th IEEE Photovoltaic Specialist Conference, PVSC 2017, Washington, United States, 6/25/17. https://doi.org/10.1109/PVSC.2017.8366444
Jeffries AM, Mamidanna A, Ding L, Hildreth O, Bertoni M. Reactive silver ink as front contacts for high efficiency silicon heterojunction solar cells. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-5 https://doi.org/10.1109/PVSC.2017.8366444
Jeffries, April M. ; Mamidanna, Avinash ; Ding, Laura ; Hildreth, Owen ; Bertoni, Mariana. / Reactive silver ink as front contacts for high efficiency silicon heterojunction solar cells. 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-5
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