TY - GEN
T1 - Reactive Silver Ink as a Novel Low-Temperature Metallization
T2 - 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018
AU - Jeffries, April M.
AU - Bertoni, Mariana
N1 - Funding Information:
The work presented herein was funded by the U.S. Department of Energy, Energy Efficiency and Renewable Energy Program, under Award Number DE-EE0008166.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/11/26
Y1 - 2018/11/26
N2 - Reactive silver ink (RSI) forms low-resistivity (<5μΩ.cm) metallization at temperatures below 100 °C-enabling lower resistive losses for thermally sensitive solar cells while drastically reducing Ag usage compared to other low-temperature Ag pastes. However, before adoption of the technology many reliability related questions must be addressed. Ag-based metallizations are susceptible to corrosion by acetic acid formed in encapsulated modules, resulting in increased resistive losses. Here we report on corrosion of three types of metallizations; high-firing-temperature Ag paste (HT Ag Paste), low-temperature Ag paste (LT Ag Paste), and RSI. We develop a method for exposing these metallizations to dilute acetic acid in concentrations comparable to those found in field- and damp heat-exposed modules. We find that HT Ag and RSI are quickly affected by acetic acid exposure after only 24 h. Interestingly, Raman spectroscopy suggests the formation of AgCl or AgCH3COO on HT Ag Paste, dissolution of AgCH3COO from RSI, and LT Ag Paste remains relatively unchanged throughout 2936 h of exposure to diluted acetic acid.
AB - Reactive silver ink (RSI) forms low-resistivity (<5μΩ.cm) metallization at temperatures below 100 °C-enabling lower resistive losses for thermally sensitive solar cells while drastically reducing Ag usage compared to other low-temperature Ag pastes. However, before adoption of the technology many reliability related questions must be addressed. Ag-based metallizations are susceptible to corrosion by acetic acid formed in encapsulated modules, resulting in increased resistive losses. Here we report on corrosion of three types of metallizations; high-firing-temperature Ag paste (HT Ag Paste), low-temperature Ag paste (LT Ag Paste), and RSI. We develop a method for exposing these metallizations to dilute acetic acid in concentrations comparable to those found in field- and damp heat-exposed modules. We find that HT Ag and RSI are quickly affected by acetic acid exposure after only 24 h. Interestingly, Raman spectroscopy suggests the formation of AgCl or AgCH3COO on HT Ag Paste, dissolution of AgCH3COO from RSI, and LT Ag Paste remains relatively unchanged throughout 2936 h of exposure to diluted acetic acid.
KW - corrosion
KW - low temperature metallization
KW - metallization
KW - silver
KW - silver usage
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U2 - 10.1109/PVSC.2018.8548247
DO - 10.1109/PVSC.2018.8548247
M3 - Conference contribution
AN - SCOPUS:85059878642
T3 - 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC
SP - 1013
EP - 1017
BT - 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 10 June 2018 through 15 June 2018
ER -