Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10 -6 to 102 s-1

X. Nie, D. Bhate, D. Chan, W. Chen, G. Subbarayan, I. Dutta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

Solder joints are subjected to different loading conditions depending on the application environment. Desktop and server applications for example, involve thermomechanical fatigue loads at low-strain rates and the dominant mode of failure is creep fatigue. Mobile electronics applications on the other hand, are subject to dynamic stresses on the solder joint during impact. In our previous work, we developed a constitutive model based on mechanical test data at low strain rates. Experiments were carried out using double-lap shear test specimens of specially prepared solder assemblies over strain rate regimes of 10-6 to 10-3 s-1 [1]. In this work, the previous experimental results are augmented with tests performed at higher strain rates (10-3 to 102 s-1) at room temperature. These experiments were performed using two different experimental setups: a MTS 810 uniaxial compression tester and a Split Hopkinson Pressure Bar (SHPB). The experimental results demonstrate a remarkably consistent relationship between the yield stress and the strain rate over eight decades of strain rate! We also fit the data to viscoplastic constitutive models popularly available in commercial finite element programs. Although the constitutive models are built using data at low strain rate regimes, the model is shown to be a reasonable fit to the experimental data over the entire strain rate regime under consideration (10-6 to 102 s-1). The differences in observed behavior under compression and tension are discussed, along with a microstructural study of the samples used in the tests.

Original languageEnglish (US)
Title of host publication2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
PublisherIEEE Computer Society
Pages676-682
Number of pages7
ISBN (Print)9781424417018
DOIs
StatePublished - Jan 1 2008
Externally publishedYes
Event2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM - Orlando,FL, United States
Duration: May 28 2008May 31 2008

Publication series

Name2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Other

Other2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
Country/TerritoryUnited States
CityOrlando,FL
Period5/28/085/31/08

Keywords

  • Constitutive modeling
  • Drop
  • High strain rate
  • Impact
  • Lead-free solder
  • Shock

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Management, Monitoring, Policy and Law
  • Energy(all)
  • Energy Engineering and Power Technology
  • Modeling and Simulation
  • Fuel Technology
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10 <sup>-6</sup> to 10<sup>2</sup> s<sup>-1</sup>'. Together they form a unique fingerprint.

Cite this