Processing of ultrathin silicon heterojunction solar cells bonded to a glass carrier

Maxwell Cotton, Stanislau Herasimenka, William J. Dauksher, Emmett Howard, Mark Strnad, Stuart Bowden

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A method of processing ultrathin silicon solar cells by bonding them to a glass carrier is described. The method allows processing large area solar cells on the wafers with down to 10 micron thickness. In the method the rear side of a solar cell is processed on a stand-alone wafer. The cell is then bonded to a glass carrier followed by chemical thinning and processing of the front side. Finally, the cell is de-bonded from the glass carrier. This work applied bonding process previously developed at Arizona State University Flexible Electronics and Display Center to a SHJ solar cell. It was found that bonding material can withstand wafer thinning and acidic cleans used in SHJ processing. We also show that bonding material doesn't contaminate PECVD or sputtering chambers and doesn't prevent achieving very good surface passivation.

Original languageEnglish (US)
Title of host publication2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages643-644
Number of pages2
Volume2016-November
ISBN (Electronic)9781509027248
DOIs
StatePublished - Nov 18 2016
Event43rd IEEE Photovoltaic Specialists Conference, PVSC 2016 - Portland, United States
Duration: Jun 5 2016Jun 10 2016

Other

Other43rd IEEE Photovoltaic Specialists Conference, PVSC 2016
CountryUnited States
CityPortland
Period6/5/166/10/16

Keywords

  • Bonding
  • Heterojunction
  • Thin Silicon

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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