Abstract

Stretchable electronics have important applications in health monitoring and integrated lab-on-a-chip devices. This paper discusses the performance of serpentine stretchable interconnects printed using self-reducing, silver reactive inks. It details process optimization, device fabrication, and device characterization, while demonstrating the potential applications for reactive inks and new design strategies in stretchable electronics. Devices were printed with an ethanol stabilized silver diamine reactive ink and cycled to stretch ratios of 140 and 160% over 1000 cycles with less than 2.5% variation in electrical resistance. Maximum deformation before failure was measured at 180% elongation. Additionally, interconnect deformation was compared to finite element analysis (FEA) simulations to show that FEA can be used to accurately model the deformation of low-strain printed interconnects. Overall, this paper demonstrates a simple and affordable route toward stretchable electrical interconnects.

Original languageEnglish (US)
Pages (from-to)12594-12598
Number of pages5
JournalACS Applied Materials and Interfaces
Volume8
Issue number20
DOIs
StatePublished - May 25 2016

Fingerprint

Ink
Printing
Silver
Electronic equipment
Finite element method
Lab-on-a-chip
Acoustic impedance
Diamines
Elongation
Ethanol
Health
Fabrication
Monitoring

Keywords

  • conductive inks
  • drop-on-demand
  • flexible electronics
  • printing
  • reactive inks
  • serpentine
  • stretchable electronics

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. / Mamidanna, Avinash; Song, Zeming; Lv, Cheng; Lefky, Christopher S.; Jiang, Hanqing; Hildreth, Owen J.

In: ACS Applied Materials and Interfaces, Vol. 8, No. 20, 25.05.2016, p. 12594-12598.

Research output: Contribution to journalArticle

Mamidanna, Avinash ; Song, Zeming ; Lv, Cheng ; Lefky, Christopher S. ; Jiang, Hanqing ; Hildreth, Owen J. / Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. In: ACS Applied Materials and Interfaces. 2016 ; Vol. 8, No. 20. pp. 12594-12598.
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