Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED)

Ali Behroozfar; Soheil Daryadel; S. Reza Morsali; Rodrigo A. Bernal; Majid Minary-Jolandan

doi:10.1115/MSEC2018-6365

Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED)

Ali Behroozfar, Soheil Daryadel, S. Reza Morsali, Rodrigo A. Bernal, Majid Minary-Jolandan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

Nanotwinned (nt) metals exhibit superior electrical and mechanical properties compared to their coarse-grained and nano-grained counterparts. They have a unique microstructure with grains that contain layered nanoscale twins divided by coherent twin boundaries (TBs). Since nanotwinned metals have low electrical resistivity and high resistance to electromigration, they are ideal materials for making nanowires, interconnections and switches. In this paper we show the possibility of making nanotwinned copper interconnections on a non-conductive substrate using a novel additive manufacturing technique called L-PED. Through this approach, microscale interconnections can be directly printed on the substrate in environmental conditions and without post processing.

Original language	English (US)
Title of host publication	Additive Manufacturing; Bio and Sustainable Manufacturing
Publisher	American Society of Mechanical Engineers (ASME)
ISBN (Print)	9780791851357
DOIs	https://doi.org/10.1115/MSEC2018-6365
State	Published - 2018
Externally published	Yes
Event	ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018 - College Station, United States Duration: Jun 18 2018 → Jun 22 2018

Publication series

Name	ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018
Volume	1

Other

Other	ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018
Country/Territory	United States
City	College Station
Period	6/18/18 → 6/22/18

ASJC Scopus subject areas

Industrial and Manufacturing Engineering

Access to Document

10.1115/MSEC2018-6365

Cite this

Behroozfar, A., Daryadel, S., Morsali, S. R., Bernal, R. A., & Minary-Jolandan, M. (2018). Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED). In Additive Manufacturing; Bio and Sustainable Manufacturing (ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018; Vol. 1). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/MSEC2018-6365

Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED). / Behroozfar, Ali; Daryadel, Soheil; Morsali, S. Reza et al.
Additive Manufacturing; Bio and Sustainable Manufacturing. American Society of Mechanical Engineers (ASME), 2018. (ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Behroozfar, A, Daryadel, S, Morsali, SR, Bernal, RA & Minary-Jolandan, M 2018, Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED). in Additive Manufacturing; Bio and Sustainable Manufacturing. ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018, vol. 1, American Society of Mechanical Engineers (ASME), ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018, College Station, United States, 6/18/18. https://doi.org/10.1115/MSEC2018-6365

Behroozfar A, Daryadel S, Morsali SR, Bernal RA, Minary-Jolandan M. Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED). In Additive Manufacturing; Bio and Sustainable Manufacturing. American Society of Mechanical Engineers (ASME). 2018. (ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018). doi: 10.1115/MSEC2018-6365

Behroozfar, Ali ; Daryadel, Soheil ; Morsali, S. Reza et al. / Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED). Additive Manufacturing; Bio and Sustainable Manufacturing. American Society of Mechanical Engineers (ASME), 2018. (ASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018).

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AB - Nanotwinned (nt) metals exhibit superior electrical and mechanical properties compared to their coarse-grained and nano-grained counterparts. They have a unique microstructure with grains that contain layered nanoscale twins divided by coherent twin boundaries (TBs). Since nanotwinned metals have low electrical resistivity and high resistance to electromigration, they are ideal materials for making nanowires, interconnections and switches. In this paper we show the possibility of making nanotwinned copper interconnections on a non-conductive substrate using a novel additive manufacturing technique called L-PED. Through this approach, microscale interconnections can be directly printed on the substrate in environmental conditions and without post processing.

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Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED)

Abstract

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