Printing of microscale nanotwinned copper interconnections using localized pulsed electrodeposition (L-PED)

Ali Behroozfar, Soheil Daryadel, S. Reza Morsali, Rodrigo A. Bernal, Majid Minary-Jolandan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Nanotwinned (nt) metals exhibit superior electrical and mechanical properties compared to their coarse-grained and nano-grained counterparts. They have a unique microstructure with grains that contain layered nanoscale twins divided by coherent twin boundaries (TBs). Since nanotwinned metals have low electrical resistivity and high resistance to electromigration, they are ideal materials for making nanowires, interconnections and switches. In this paper we show the possibility of making nanotwinned copper interconnections on a non-conductive substrate using a novel additive manufacturing technique called L-PED. Through this approach, microscale interconnections can be directly printed on the substrate in environmental conditions and without post processing.

Original languageEnglish (US)
Title of host publicationAdditive Manufacturing; Bio and Sustainable Manufacturing
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)9780791851357
DOIs
StatePublished - 2018
Externally publishedYes
EventASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018 - College Station, United States
Duration: Jun 18 2018Jun 22 2018

Publication series

NameASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018
Volume1

Other

OtherASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018
Country/TerritoryUnited States
CityCollege Station
Period6/18/186/22/18

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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