Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management

Tae Ho Kim, Won Mook Choi, Dae Hyeong Kim, Matthew A. Meitl, Etienne Menard, Hanqing Jiang, John A. Carlisle, John A. Rogers

Research output: Contribution to journalArticle

54 Scopus citations

Abstract

Etching and printing techniques that are used to manipulate thin film microstructures of diamond in a way that allows integration with substrates and creation of structural forms that are incompatible with conventional processing was investigated. A SiO2 layer was deposited by plasma-enhanced chemical vapor deposition (PECVD) using SiH4 and N2O at 250°C. Photolithography with AZ 5214 defined a pattern of photoresist (PR) on the surface of the SiO2 (300 nm)/UNCD (400 nm)/SiO2/Si substrate. The PR served as a mask for RIE etching of the PECVD SiO2 layer with a Cf4 plasma. It was observed that the resulting capabilities could be useful for certain applications, such as those in thermal management for plastic electronics.

Original languageEnglish (US)
Pages (from-to)2171-2176
Number of pages6
JournalAdvanced Materials
Volume20
Issue number11
DOIs
StatePublished - Jun 4 2008

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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    Kim, T. H., Choi, W. M., Kim, D. H., Meitl, M. A., Menard, E., Jiang, H., Carlisle, J. A., & Rogers, J. A. (2008). Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management. Advanced Materials, 20(11), 2171-2176. https://doi.org/10.1002/adma.200702434