@inproceedings{bce6b522957b47f2a8acac0f74223168,
title = "Principal pilot line manufacturing challenges and solutions in direct fabrication of a-Si:H TFT arrays on flexible substrates",
abstract = "Principal challenges to direct fabrication of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. In collaboration with our industrial and academic partners, we have developed viable solutions to address these challenges, as described in this paper.",
author = "O'Rourke, {Shawn M.} and Loy, {Douglas E.} and Curt Moyer and Ageno, {Scott K.} and O'Brien, {Barry P.} and Bawolek, {Edward J.} and Dirk Bottesch and Michael Marrs and Jeff Dailey and Rita Cordova and Jovan Trujillo and Jann Kaminski and David Allee and Sameer Venugopal and Gregory Raupp",
year = "2008",
language = "English (US)",
isbn = "9781605608228",
series = "Materials Research Society Symposium Proceedings",
pages = "73--81",
booktitle = "Large-Area Processing and Patterning for Active Optical and Electronic Devices",
note = "2007 MRS Fall Meeting ; Conference date: 26-11-2007 Through 30-11-2007",
}