TY - GEN
T1 - Predicting crack growth and fatigue lives of QFN solder joints using a multiscale fracture model
AU - Chan, Dennis
AU - Bhate, Dhruv
AU - Subbarayan, Ganesh
AU - Zhao, Jeff
AU - Edwards, Darvin
PY - 2010/6/30
Y1 - 2010/6/30
N2 - The hierarchal fracture process model is a theory derived from continuum thermodynamics and information theory. This single parameter model provides a non-empirical approach able to predict crack growth for solder interconnects regardless of package or solder interconnect geometry. The model relates inelastic dissipations to the probability of failure at a given material point. The hierarchal fracture process model is used to predict crack growth and fatigue lives in a package with atypical solder interconnect geometry: a quad-flat-no-lead (QFN) package. The fracture model uses the material parameter calibrated for Sn3.8wt%0.7wt%Cu solder in a previous study of wafer-level CSP packages. Finite element models of these packages are created in ABAQUS with the solder interconnects given full creep and plastic properties. The results obtained from the hierarchal fracture process model are validated against the experimentally obtained fatigue lives and cross-sectional images of the crack path.
AB - The hierarchal fracture process model is a theory derived from continuum thermodynamics and information theory. This single parameter model provides a non-empirical approach able to predict crack growth for solder interconnects regardless of package or solder interconnect geometry. The model relates inelastic dissipations to the probability of failure at a given material point. The hierarchal fracture process model is used to predict crack growth and fatigue lives in a package with atypical solder interconnect geometry: a quad-flat-no-lead (QFN) package. The fracture model uses the material parameter calibrated for Sn3.8wt%0.7wt%Cu solder in a previous study of wafer-level CSP packages. Finite element models of these packages are created in ABAQUS with the solder interconnects given full creep and plastic properties. The results obtained from the hierarchal fracture process model are validated against the experimentally obtained fatigue lives and cross-sectional images of the crack path.
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U2 - 10.1115/InterPACK2009-89403
DO - 10.1115/InterPACK2009-89403
M3 - Conference contribution
AN - SCOPUS:77953947750
SN - 9780791843604
T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009
SP - 207
EP - 213
BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009
T2 - 2009 ASME InterPack Conference, IPACK2009
Y2 - 19 July 2009 through 23 July 2009
ER -