TY - JOUR
T1 - Power, interface, and integration
T2 - Handset chipset design issues
AU - Han, Tae Heen
AU - Yoo, Jae Chern
AU - Lee, Hyunseok
N1 - Funding Information:
This article was supported by the Faculty Research Fund, Sungkyunkwan University, 2008.
Copyright:
Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2009/11
Y1 - 2009/11
N2 - In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.
AB - In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.
UR - http://www.scopus.com/inward/record.url?scp=70449516987&partnerID=8YFLogxK
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U2 - 10.1109/MCOM.2009.5307482
DO - 10.1109/MCOM.2009.5307482
M3 - Article
AN - SCOPUS:70449516987
VL - 47
SP - 172
EP - 179
JO - IEEE Communications Magazine
JF - IEEE Communications Magazine
SN - 0163-6804
IS - 11
M1 - 5307482
ER -