Power, interface, and integration: Handset chipset design issues

Tae Heen Han; Jae Chern Yoo; Hyunseok Lee

doi:10.1109/MCOM.2009.5307482

Power, interface, and integration: Handset chipset design issues

Tae Heen Han, Jae Chern Yoo, Hyunseok Lee

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.

Original language	English (US)
Article number	5307482
Pages (from-to)	172-179
Number of pages	8
Journal	IEEE Communications Magazine
Volume	47
Issue number	11
DOIs	https://doi.org/10.1109/MCOM.2009.5307482
State	Published - Nov 2009
Externally published	Yes

ASJC Scopus subject areas

Computer Science Applications
Computer Networks and Communications
Electrical and Electronic Engineering

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10.1109/MCOM.2009.5307482

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abstract = "In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.",

author = "Han, {Tae Heen} and Yoo, {Jae Chern} and Hyunseok Lee",

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Power, interface, and integration: Handset chipset design issues

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ASJC Scopus subject areas

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