Power, interface, and integration: Handset chipset design issues

Tae Heen Han; Jae Chern Yoo; Hyunseok Lee

doi:10.1109/MCOM.2009.5307482

Power, interface, and integration: Handset chipset design issues

Tae Heen Han, Jae Chern Yoo, Hyunseok Lee

Arizona State University

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.

Original language	English (US)
Article number	5307482
Pages (from-to)	172-179
Number of pages	8
Journal	IEEE Communications Magazine
Volume	47
Issue number	11
DOIs	https://doi.org/10.1109/MCOM.2009.5307482
State	Published - Nov 2009

ASJC Scopus subject areas

Computer Science Applications
Computer Networks and Communications
Electrical and Electronic Engineering

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@article{8c8904757c0446a3ab246d59c7a20954,

title = "Power, interface, and integration: Handset chipset design issues",

abstract = "In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.",

author = "Han, {Tae Heen} and Yoo, {Jae Chern} and Hyunseok Lee",

year = "2009",

month = nov,

doi = "10.1109/MCOM.2009.5307482",

language = "English (US)",

volume = "47",

pages = "172--179",

journal = "IEEE Communications Magazine",

issn = "0163-6804",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "11",

}

TY - JOUR

T1 - Power, interface, and integration

T2 - Handset chipset design issues

AU - Han, Tae Heen

AU - Yoo, Jae Chern

AU - Lee, Hyunseok

PY - 2009/11

Y1 - 2009/11

N2 - In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.

AB - In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax System-on-a-Chip development.

UR - http://www.scopus.com/inward/record.url?scp=70449516987&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=70449516987&partnerID=8YFLogxK

U2 - 10.1109/MCOM.2009.5307482

DO - 10.1109/MCOM.2009.5307482

M3 - Article

AN - SCOPUS:70449516987

VL - 47

SP - 172

EP - 179

JO - IEEE Communications Magazine

JF - IEEE Communications Magazine

SN - 0163-6804

IS - 11

M1 - 5307482

ER -

Power, interface, and integration: Handset chipset design issues

Abstract

ASJC Scopus subject areas

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