@inproceedings{a8d709fe802a44fc9830ed8a09b707d1,
title = "Potential of Ag interconnect and contact metallization for various applications via Cu additions",
abstract = "The thermal stability of Ag(Cu) alloy thin films on indium tin oxide (ITO) has been investigated and compared to that of pure Ag thin films on ITO. Atomic force microscopy and Xray diffraction results of annealed films show differences in the evolution of surface morphology and texture with annealing. The presence of Cu atoms in the silver impacts the surface energy and surface diffusion. This results in Ag and Ag(Cu) alloy having very different surface morphology and crystallographic texture. The enhanced texture and thermal stability of the Ag(Cu) alloy constitute its potential use contact as material for MOSFET and for flip-chip lightemitting diodes.",
author = "Hauk Han and Yeongseok Zoo and Mayer, {James W.} and Terry Alford",
year = "2007",
doi = "10.1557/proc-0990-b08-24",
language = "English (US)",
isbn = "9781558999503",
series = "Materials Research Society Symposium Proceedings",
publisher = "Materials Research Society",
pages = "191--196",
booktitle = "Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics",
note = "2007 MRS Spring Meeting ; Conference date: 09-04-2007 Through 13-04-2007",
}