Potential of Ag interconnect and contact metallization for various applications via Cu additions

Hauk Han, Yeongseok Zoo, James W. Mayer, Terry Alford

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thermal stability of Ag(Cu) alloy thin films on indium tin oxide (ITO) has been investigated and compared to that of pure Ag thin films on ITO. Atomic force microscopy and Xray diffraction results of annealed films show differences in the evolution of surface morphology and texture with annealing. The presence of Cu atoms in the silver impacts the surface energy and surface diffusion. This results in Ag and Ag(Cu) alloy having very different surface morphology and crystallographic texture. The enhanced texture and thermal stability of the Ag(Cu) alloy constitute its potential use contact as material for MOSFET and for flip-chip lightemitting diodes.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium Proceedings
Pages191-196
Number of pages6
Volume990
StatePublished - 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 10 2007Apr 12 2007

Other

Other2007 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/10/074/12/07

Fingerprint

Metallizing
Textures
Tin oxides
Indium
Surface morphology
Thermodynamic stability
Thin films
Surface diffusion
Silver
Interfacial energy
Atomic force microscopy
Diodes
Diffraction
Annealing
Atoms
indium tin oxide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Han, H., Zoo, Y., Mayer, J. W., & Alford, T. (2007). Potential of Ag interconnect and contact metallization for various applications via Cu additions. In Materials Research Society Symposium Proceedings (Vol. 990, pp. 191-196)

Potential of Ag interconnect and contact metallization for various applications via Cu additions. / Han, Hauk; Zoo, Yeongseok; Mayer, James W.; Alford, Terry.

Materials Research Society Symposium Proceedings. Vol. 990 2007. p. 191-196.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Han, H, Zoo, Y, Mayer, JW & Alford, T 2007, Potential of Ag interconnect and contact metallization for various applications via Cu additions. in Materials Research Society Symposium Proceedings. vol. 990, pp. 191-196, 2007 MRS Spring Meeting, San Francisco, CA, United States, 4/10/07.
Han H, Zoo Y, Mayer JW, Alford T. Potential of Ag interconnect and contact metallization for various applications via Cu additions. In Materials Research Society Symposium Proceedings. Vol. 990. 2007. p. 191-196
Han, Hauk ; Zoo, Yeongseok ; Mayer, James W. ; Alford, Terry. / Potential of Ag interconnect and contact metallization for various applications via Cu additions. Materials Research Society Symposium Proceedings. Vol. 990 2007. pp. 191-196
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