Potential of Ag interconnect and contact metallization for various applications via Cu additions

Hauk Han, Yeongseok Zoo, James W. Mayer, Terry Alford

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thermal stability of Ag(Cu) alloy thin films on indium tin oxide (ITO) has been investigated and compared to that of pure Ag thin films on ITO. Atomic force microscopy and Xray diffraction results of annealed films show differences in the evolution of surface morphology and texture with annealing. The presence of Cu atoms in the silver impacts the surface energy and surface diffusion. This results in Ag and Ag(Cu) alloy having very different surface morphology and crystallographic texture. The enhanced texture and thermal stability of the Ag(Cu) alloy constitute its potential use contact as material for MOSFET and for flip-chip lightemitting diodes.

Original languageEnglish (US)
Title of host publicationMaterials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
PublisherMaterials Research Society
Pages191-196
Number of pages6
ISBN (Print)9781558999503
DOIs
StatePublished - 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 9 2007Apr 13 2007

Publication series

NameMaterials Research Society Symposium Proceedings
Volume990
ISSN (Print)0272-9172

Other

Other2007 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/9/074/13/07

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Han, H., Zoo, Y., Mayer, J. W., & Alford, T. (2007). Potential of Ag interconnect and contact metallization for various applications via Cu additions. In Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics (pp. 191-196). (Materials Research Society Symposium Proceedings; Vol. 990). Materials Research Society. https://doi.org/10.1557/proc-0990-b08-24