Periodic steady-state thermal analysis of a high-Tc superconducting microbolometer

Kazuyoshi Fushinobu; Patrick E. Phelan; Kunio Hijikata; Takao Nagasaki; M. I. Flik

Periodic steady-state thermal analysis of a high-T_c superconducting microbolometer

Kazuyoshi Fushinobu, Patrick E. Phelan, Kunio Hijikata, Takao Nagasaki, M. I. Flik

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Microbolometers are infrared detectors whose sensitivity depends on their thermal response to chopped incident radiation. Numerical analysis of the three-dimensional complex temperature fields in the superconducting film and the substrate shows that the conductance between the film and the substrate is a sensitive function of frequency above a critical frequency, which depends on the substrate thermal diffusivity and the film/substrate contact area. An approximate analysis, which models the film as a hemisphere embedded in the substrate, yields a temperature increase that is at most 25 percent too high. The finite film volume and the substrate thickness both significantly influence the film-substrate conductance under certain conditions.

Original language	English (US)
Title of host publication	Heat Transfer on the Microscale
Publisher	Publ by ASME
Pages	89-95
Number of pages	7
ISBN (Print)	0791809269
State	Published - Dec 1 1992
Externally published	Yes
Event	28th National Heat Transfer Conference and Exhibition - San Diego, CA, USA Duration: Aug 9 1992 → Aug 12 1992

Publication series

Name	American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume	200
ISSN (Print)	0272-5673

Other

Other	28th National Heat Transfer Conference and Exhibition
City	San Diego, CA, USA
Period	8/9/92 → 8/12/92

ASJC Scopus subject areas

Mechanical Engineering
Fluid Flow and Transfer Processes

Cite this

Periodic steady-state thermal analysis of a high-T_c superconducting microbolometer. / Fushinobu, Kazuyoshi; Phelan, Patrick E.; Hijikata, Kunio et al.
Heat Transfer on the Microscale. Publ by ASME, 1992. p. 89-95 (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; Vol. 200).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fushinobu, K, Phelan, PE, Hijikata, K, Nagasaki, T & Flik, MI 1992, Periodic steady-state thermal analysis of a high-T_c superconducting microbolometer. in Heat Transfer on the Microscale. American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, vol. 200, Publ by ASME, pp. 89-95, 28th National Heat Transfer Conference and Exhibition, San Diego, CA, USA, 8/9/92.

@inproceedings{efdec515cb9b4d0298ab030485782fb9,

title = "Periodic steady-state thermal analysis of a high-Tc superconducting microbolometer",

abstract = "Microbolometers are infrared detectors whose sensitivity depends on their thermal response to chopped incident radiation. Numerical analysis of the three-dimensional complex temperature fields in the superconducting film and the substrate shows that the conductance between the film and the substrate is a sensitive function of frequency above a critical frequency, which depends on the substrate thermal diffusivity and the film/substrate contact area. An approximate analysis, which models the film as a hemisphere embedded in the substrate, yields a temperature increase that is at most 25 percent too high. The finite film volume and the substrate thickness both significantly influence the film-substrate conductance under certain conditions.",

author = "Kazuyoshi Fushinobu and Phelan, {Patrick E.} and Kunio Hijikata and Takao Nagasaki and Flik, {M. I.}",

year = "1992",

month = dec,

day = "1",

language = "English (US)",

isbn = "0791809269",

series = "American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD",

publisher = "Publ by ASME",

pages = "89--95",

booktitle = "Heat Transfer on the Microscale",

note = "28th National Heat Transfer Conference and Exhibition ; Conference date: 09-08-1992 Through 12-08-1992",

}

TY - GEN

T1 - Periodic steady-state thermal analysis of a high-Tc superconducting microbolometer

AU - Fushinobu, Kazuyoshi

AU - Phelan, Patrick E.

AU - Hijikata, Kunio

AU - Nagasaki, Takao

AU - Flik, M. I.

PY - 1992/12/1

Y1 - 1992/12/1

N2 - Microbolometers are infrared detectors whose sensitivity depends on their thermal response to chopped incident radiation. Numerical analysis of the three-dimensional complex temperature fields in the superconducting film and the substrate shows that the conductance between the film and the substrate is a sensitive function of frequency above a critical frequency, which depends on the substrate thermal diffusivity and the film/substrate contact area. An approximate analysis, which models the film as a hemisphere embedded in the substrate, yields a temperature increase that is at most 25 percent too high. The finite film volume and the substrate thickness both significantly influence the film-substrate conductance under certain conditions.

AB - Microbolometers are infrared detectors whose sensitivity depends on their thermal response to chopped incident radiation. Numerical analysis of the three-dimensional complex temperature fields in the superconducting film and the substrate shows that the conductance between the film and the substrate is a sensitive function of frequency above a critical frequency, which depends on the substrate thermal diffusivity and the film/substrate contact area. An approximate analysis, which models the film as a hemisphere embedded in the substrate, yields a temperature increase that is at most 25 percent too high. The finite film volume and the substrate thickness both significantly influence the film-substrate conductance under certain conditions.

UR - http://www.scopus.com/inward/record.url?scp=0027069305&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027069305&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027069305

SN - 0791809269

T3 - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

SP - 89

EP - 95

BT - Heat Transfer on the Microscale

PB - Publ by ASME

T2 - 28th National Heat Transfer Conference and Exhibition

Y2 - 9 August 1992 through 12 August 1992

ER -