Performance comparison of mesoscale refrigeration technologies for electronics packaging

Patrick Phelan, Victor Chiriac, Tien Yu Tom Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors' previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC's) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.

Original languageEnglish (US)
Title of host publicationAdvances in Electronic Packaging 2003
Subtitle of host publicationVolume 2
PublisherAmerican Society of Mechanical Engineers
Pages309-315
Number of pages7
ISBN (Print)0791836916, 9780791836910
DOIs
StatePublished - Jan 1 2003
Event2003 International Electronic Packaging Technical Conference and Exhibition - Maui, HI, United States
Duration: Jul 6 2003Jul 11 2003

Publication series

NameAdvances in Electronic Packaging
Volume2

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityMaui, HI
Period7/6/037/11/03

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Phelan, P., Chiriac, V., & Lee, T. Y. T. (2003). Performance comparison of mesoscale refrigeration technologies for electronics packaging. In Advances in Electronic Packaging 2003: Volume 2 (pp. 309-315). (Advances in Electronic Packaging; Vol. 2). American Society of Mechanical Engineers. https://doi.org/10.1115/ipack2003-35140