Performance comparison of mesoscale refrigeration technologies for electronics packaging

Patrick Phelan, Victor Chiriac, Tien Yu Tom Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors' previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC's) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.

Original languageEnglish (US)
Title of host publicationAdvances in Electronic Packaging
Pages309-315
Number of pages7
Volume2
StatePublished - 2003
Event2003 International Electronic Packaging Technical Conference and Exhibition - Maui, HI, United States
Duration: Jul 6 2003Jul 11 2003

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityMaui, HI
Period7/6/037/11/03

Fingerprint

Electronics packaging
Refrigerators
Refrigeration
Vapors
Microelectronics
Compressors

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Phelan, P., Chiriac, V., & Lee, T. Y. T. (2003). Performance comparison of mesoscale refrigeration technologies for electronics packaging. In Advances in Electronic Packaging (Vol. 2, pp. 309-315)

Performance comparison of mesoscale refrigeration technologies for electronics packaging. / Phelan, Patrick; Chiriac, Victor; Lee, Tien Yu Tom.

Advances in Electronic Packaging. Vol. 2 2003. p. 309-315.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phelan, P, Chiriac, V & Lee, TYT 2003, Performance comparison of mesoscale refrigeration technologies for electronics packaging. in Advances in Electronic Packaging. vol. 2, pp. 309-315, 2003 International Electronic Packaging Technical Conference and Exhibition, Maui, HI, United States, 7/6/03.
Phelan P, Chiriac V, Lee TYT. Performance comparison of mesoscale refrigeration technologies for electronics packaging. In Advances in Electronic Packaging. Vol. 2. 2003. p. 309-315
Phelan, Patrick ; Chiriac, Victor ; Lee, Tien Yu Tom. / Performance comparison of mesoscale refrigeration technologies for electronics packaging. Advances in Electronic Packaging. Vol. 2 2003. pp. 309-315
@inproceedings{515800be22da49a79037533899bbac54,
title = "Performance comparison of mesoscale refrigeration technologies for electronics packaging",
abstract = "Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors' previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC's) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.",
author = "Patrick Phelan and Victor Chiriac and Lee, {Tien Yu Tom}",
year = "2003",
language = "English (US)",
isbn = "0791836916",
volume = "2",
pages = "309--315",
booktitle = "Advances in Electronic Packaging",

}

TY - GEN

T1 - Performance comparison of mesoscale refrigeration technologies for electronics packaging

AU - Phelan, Patrick

AU - Chiriac, Victor

AU - Lee, Tien Yu Tom

PY - 2003

Y1 - 2003

N2 - Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors' previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC's) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.

AB - Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors' previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC's) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.

UR - http://www.scopus.com/inward/record.url?scp=1242331901&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1242331901&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:1242331901

SN - 0791836916

SN - 9780791836910

VL - 2

SP - 309

EP - 315

BT - Advances in Electronic Packaging

ER -