TY - GEN
T1 - Performance comparison of mesoscale refrigeration technologies for electronics packaging
AU - Phelan, Patrick
AU - Chiriac, Victor
AU - Lee, Tien Yu Tom
PY - 2003/1/1
Y1 - 2003/1/1
N2 - Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors' previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC's) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.
AB - Utilizing refrigeration is one alternative to improve the operating performance of microelectronic devices. Unless large-scale refrigeration systems are acceptable, it is likely that miniature, or mesoscale, refrigerators will be required that can be directly incorporated into electronic packaging. The present study builds on the authors' previous investigation of mesoscale refrigerators, which emphasized how only thermoelectric coolers (TEC's) are capable of being miniaturized in the near future. Many other refrigeration systems, however, are being examined for their potential to be miniaturized, including the vapor-compression, Stirling, and pulse-tube cycles. Here a simple analysis is presented that shows the feasibility of utilizing these systems in electronics packaging. One finding is that, provided a suitable mesoscale compressor can be constructed, a vapor-compression refrigerator may yield the best performance of the investigated systems.
UR - http://www.scopus.com/inward/record.url?scp=1242331901&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1242331901&partnerID=8YFLogxK
U2 - 10.1115/ipack2003-35140
DO - 10.1115/ipack2003-35140
M3 - Conference contribution
AN - SCOPUS:1242331901
SN - 0791836916
SN - 9780791836910
T3 - Advances in Electronic Packaging
SP - 309
EP - 315
BT - Advances in Electronic Packaging 2003
PB - American Society of Mechanical Engineers
T2 - 2003 International Electronic Packaging Technical Conference and Exhibition
Y2 - 6 July 2003 through 11 July 2003
ER -