Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials

Amit Devpura, Patrick Phelan, Ravi S. Prasher

Research output: Chapter in Book/Report/Conference proceedingChapter

16 Citations (Scopus)

Abstract

An important aspect in electronic packaging is the heat dissipation. Flip-chip technology is widely being used to increase the rate of heat transfer from the chip. A method to further enhance the thermal conductivity is by the use of a thermal interface material between the device and the heat sink attached to it in the flip-chip technology. Percolation theory holds a key to understanding the behavior of thermal interface materials. Percolation, used widely in electrical engineering, is a physical phenomenon in which the highly conducting particles distributed randomly in the matrix form at least one continuous chain connecting the opposite faces of the matrix. This phenomenon was simulated using the matrix method, to study the effect of different shapes and size of the filler particles. The different shapes considered were spherical, vertical or horizontal rods, and flakes in horizontal or vertical orientation. The effect of the size of these particles was also examined. The results indicate that the composites with particles having the largest side in the direction of heat flow will always have a better conductivity than the particles oriented normal to it. Also, from the results, we can choose the best filler size in the composite if we know the filler concentration we are aiming at.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Pages365-371
Number of pages7
Volume366
StatePublished - 2000

Fingerprint

Fillers
Heat transfer
Electronics packaging
Electrical engineering
Composite materials
Heat sinks
Heat losses
Thermal conductivity
Hot Temperature
Direction compound

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

Cite this

Devpura, A., Phelan, P., & Prasher, R. S. (2000). Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials. In American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD (Vol. 366, pp. 365-371)

Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials. / Devpura, Amit; Phelan, Patrick; Prasher, Ravi S.

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 366 2000. p. 365-371.

Research output: Chapter in Book/Report/Conference proceedingChapter

Devpura, A, Phelan, P & Prasher, RS 2000, Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials. in American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. vol. 366, pp. 365-371.
Devpura A, Phelan P, Prasher RS. Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials. In American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 366. 2000. p. 365-371
Devpura, Amit ; Phelan, Patrick ; Prasher, Ravi S. / Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials. American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 366 2000. pp. 365-371
@inbook{8d821d229b6f4a11851986270d3fa914,
title = "Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials",
abstract = "An important aspect in electronic packaging is the heat dissipation. Flip-chip technology is widely being used to increase the rate of heat transfer from the chip. A method to further enhance the thermal conductivity is by the use of a thermal interface material between the device and the heat sink attached to it in the flip-chip technology. Percolation theory holds a key to understanding the behavior of thermal interface materials. Percolation, used widely in electrical engineering, is a physical phenomenon in which the highly conducting particles distributed randomly in the matrix form at least one continuous chain connecting the opposite faces of the matrix. This phenomenon was simulated using the matrix method, to study the effect of different shapes and size of the filler particles. The different shapes considered were spherical, vertical or horizontal rods, and flakes in horizontal or vertical orientation. The effect of the size of these particles was also examined. The results indicate that the composites with particles having the largest side in the direction of heat flow will always have a better conductivity than the particles oriented normal to it. Also, from the results, we can choose the best filler size in the composite if we know the filler concentration we are aiming at.",
author = "Amit Devpura and Patrick Phelan and Prasher, {Ravi S.}",
year = "2000",
language = "English (US)",
volume = "366",
pages = "365--371",
booktitle = "American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD",

}

TY - CHAP

T1 - Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials

AU - Devpura, Amit

AU - Phelan, Patrick

AU - Prasher, Ravi S.

PY - 2000

Y1 - 2000

N2 - An important aspect in electronic packaging is the heat dissipation. Flip-chip technology is widely being used to increase the rate of heat transfer from the chip. A method to further enhance the thermal conductivity is by the use of a thermal interface material between the device and the heat sink attached to it in the flip-chip technology. Percolation theory holds a key to understanding the behavior of thermal interface materials. Percolation, used widely in electrical engineering, is a physical phenomenon in which the highly conducting particles distributed randomly in the matrix form at least one continuous chain connecting the opposite faces of the matrix. This phenomenon was simulated using the matrix method, to study the effect of different shapes and size of the filler particles. The different shapes considered were spherical, vertical or horizontal rods, and flakes in horizontal or vertical orientation. The effect of the size of these particles was also examined. The results indicate that the composites with particles having the largest side in the direction of heat flow will always have a better conductivity than the particles oriented normal to it. Also, from the results, we can choose the best filler size in the composite if we know the filler concentration we are aiming at.

AB - An important aspect in electronic packaging is the heat dissipation. Flip-chip technology is widely being used to increase the rate of heat transfer from the chip. A method to further enhance the thermal conductivity is by the use of a thermal interface material between the device and the heat sink attached to it in the flip-chip technology. Percolation theory holds a key to understanding the behavior of thermal interface materials. Percolation, used widely in electrical engineering, is a physical phenomenon in which the highly conducting particles distributed randomly in the matrix form at least one continuous chain connecting the opposite faces of the matrix. This phenomenon was simulated using the matrix method, to study the effect of different shapes and size of the filler particles. The different shapes considered were spherical, vertical or horizontal rods, and flakes in horizontal or vertical orientation. The effect of the size of these particles was also examined. The results indicate that the composites with particles having the largest side in the direction of heat flow will always have a better conductivity than the particles oriented normal to it. Also, from the results, we can choose the best filler size in the composite if we know the filler concentration we are aiming at.

UR - http://www.scopus.com/inward/record.url?scp=0007264901&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0007264901&partnerID=8YFLogxK

M3 - Chapter

AN - SCOPUS:0007264901

VL - 366

SP - 365

EP - 371

BT - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

ER -