Packaging and non-hermetic encapsulation technology for flip chip on implantable MEMS devices

Jemmy Sutanto, Sindhu Anand, Arati Sridharan, Robert Korb, Li Zhou, Michael S. Baker, Murat Okandan, Jitendran Muthuswamy

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

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Engineering & Materials Science