TY - GEN
T1 - Optimized Stress Testing for Flexible Hybrid Electronics Designs
AU - Gao, Hang
AU - Bhat, Ganapati
AU - Ogras, Umit Y.
AU - Ozev, Sule
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4
Y1 - 2019/4
N2 - Flexible hybrid electronics (FHE) is emerging as a promising solution to combine the benefits of printed electronics and silicon technology. FHE has many high-impact potential areas, such as wearable applications, health monitoring, and soft robotics, due to its physical advantages, which include light weight, low cost and the ability conform to different shapes. However, physical deformations in the field can lead to significant testing and validation challenges. For example, designers must ensure that FHE devices continue to meet their specs even when the components experience stress due to bending. Hence, physical deformation, which is hard to emulate, has to be part of the test procedures for FHE devices. This paper is the first to analyze stress experience at different parts of FHE devices under different bending conditions. We develop a novel methodology to maximize the test coverage with minimum number of text vectors with the help of a mixed integer linear programming formulation. We validate the proposed approach using an FHE prototype and COMSOL Multiphysics simulations.
AB - Flexible hybrid electronics (FHE) is emerging as a promising solution to combine the benefits of printed electronics and silicon technology. FHE has many high-impact potential areas, such as wearable applications, health monitoring, and soft robotics, due to its physical advantages, which include light weight, low cost and the ability conform to different shapes. However, physical deformations in the field can lead to significant testing and validation challenges. For example, designers must ensure that FHE devices continue to meet their specs even when the components experience stress due to bending. Hence, physical deformation, which is hard to emulate, has to be part of the test procedures for FHE devices. This paper is the first to analyze stress experience at different parts of FHE devices under different bending conditions. We develop a novel methodology to maximize the test coverage with minimum number of text vectors with the help of a mixed integer linear programming formulation. We validate the proposed approach using an FHE prototype and COMSOL Multiphysics simulations.
KW - COMSOL Multiphysics
KW - Flexible hybrid electronics
KW - integer linear programming
KW - stress
KW - test
UR - http://www.scopus.com/inward/record.url?scp=85069210734&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85069210734&partnerID=8YFLogxK
U2 - 10.1109/VTS.2019.8758661
DO - 10.1109/VTS.2019.8758661
M3 - Conference contribution
AN - SCOPUS:85069210734
T3 - Proceedings of the IEEE VLSI Test Symposium
BT - 2019 IEEE 37th VLSI Test Symposium, VTS 2019
PB - IEEE Computer Society
T2 - 37th IEEE VLSI Test Symposium, VTS 2019
Y2 - 23 April 2019 through 25 April 2019
ER -