Optimization of electrothermal material parameters using inverse modeling

Rainer Minixhofer; Stefan Holzer; Clemens Heitzinger; Johannes Fellner; Tibor Grasser; Siegfried Selberherr

doi:10.1109/ESSDERC.2003.1256889

Optimization of electrothermal material parameters using inverse modeling

Rainer Minixhofer, Stefan Holzer, Clemens Heitzinger, Johannes Fellner, Tibor Grasser, Siegfried Selberherr

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of polysilicon fuses for reliability and speed.

Original language	English (US)
Title of host publication	ESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference
Editors	Jose Franca, Paulo Freitas
Publisher	IEEE Computer Society
Pages	363-366
Number of pages	4
ISBN (Electronic)	0780379993
ISBN (Print)	9780780379992
DOIs	https://doi.org/10.1109/ESSDERC.2003.1256889
State	Published - 2003
Externally published	Yes
Event	33rd European Solid-State Device Research Conference, ESSDERC 2003 - Estoril, Portugal Duration: Sep 16 2003 → Sep 18 2003

Publication series

Name	European Solid-State Device Research Conference
ISSN (Print)	1930-8876

Other

Other	33rd European Solid-State Device Research Conference, ESSDERC 2003
Country/Territory	Portugal
City	Estoril
Period	9/16/03 → 9/18/03

ASJC Scopus subject areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality

Access to Document

10.1109/ESSDERC.2003.1256889

Cite this

Minixhofer, R., Holzer, S., Heitzinger, C., Fellner, J., Grasser, T., & Selberherr, S. (2003). Optimization of electrothermal material parameters using inverse modeling. In J. Franca, & P. Freitas (Eds.), ESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference (pp. 363-366). Article 1256889 (European Solid-State Device Research Conference). IEEE Computer Society. https://doi.org/10.1109/ESSDERC.2003.1256889

Optimization of electrothermal material parameters using inverse modeling. / Minixhofer, Rainer; Holzer, Stefan; Heitzinger, Clemens et al.
ESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference. ed. / Jose Franca; Paulo Freitas. IEEE Computer Society, 2003. p. 363-366 1256889 (European Solid-State Device Research Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Minixhofer, R, Holzer, S, Heitzinger, C, Fellner, J, Grasser, T & Selberherr, S 2003, Optimization of electrothermal material parameters using inverse modeling. in J Franca & P Freitas (eds), ESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference., 1256889, European Solid-State Device Research Conference, IEEE Computer Society, pp. 363-366, 33rd European Solid-State Device Research Conference, ESSDERC 2003, Estoril, Portugal, 9/16/03. https://doi.org/10.1109/ESSDERC.2003.1256889

Minixhofer R, Holzer S, Heitzinger C, Fellner J, Grasser T, Selberherr S. Optimization of electrothermal material parameters using inverse modeling. In Franca J, Freitas P, editors, ESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference. IEEE Computer Society. 2003. p. 363-366. 1256889. (European Solid-State Device Research Conference). doi: 10.1109/ESSDERC.2003.1256889

@inproceedings{06904f6b224a4d6eb08b3e543ab7006f,

title = "Optimization of electrothermal material parameters using inverse modeling",

abstract = "A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of polysilicon fuses for reliability and speed.",

author = "Rainer Minixhofer and Stefan Holzer and Clemens Heitzinger and Johannes Fellner and Tibor Grasser and Siegfried Selberherr",

note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 33rd European Solid-State Device Research Conference, ESSDERC 2003 ; Conference date: 16-09-2003 Through 18-09-2003",

year = "2003",

doi = "10.1109/ESSDERC.2003.1256889",

language = "English (US)",

isbn = "9780780379992",

series = "European Solid-State Device Research Conference",

publisher = "IEEE Computer Society",

pages = "363--366",

editor = "Jose Franca and Paulo Freitas",

booktitle = "ESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference",

}

TY - GEN

T1 - Optimization of electrothermal material parameters using inverse modeling

AU - Minixhofer, Rainer

AU - Holzer, Stefan

AU - Heitzinger, Clemens

AU - Fellner, Johannes

AU - Grasser, Tibor

AU - Selberherr, Siegfried

PY - 2003

Y1 - 2003

N2 - A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of polysilicon fuses for reliability and speed.

AB - A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of polysilicon fuses for reliability and speed.

UR - http://www.scopus.com/inward/record.url?scp=33845871640&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33845871640&partnerID=8YFLogxK

U2 - 10.1109/ESSDERC.2003.1256889

DO - 10.1109/ESSDERC.2003.1256889

M3 - Conference contribution

AN - SCOPUS:33845871640

SN - 9780780379992

T3 - European Solid-State Device Research Conference

SP - 363

EP - 366

BT - ESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference

A2 - Franca, Jose

A2 - Freitas, Paulo

PB - IEEE Computer Society

T2 - 33rd European Solid-State Device Research Conference, ESSDERC 2003

Y2 - 16 September 2003 through 18 September 2003

ER -

Optimization of electrothermal material parameters using inverse modeling

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this