Abstract

We demonstrate the integration of vertical-cavity surface-emitting laser (VCSEL) arrays with Si-dummy chips for potential use in short-distance parallel optical interconnects. An 8×8 flip-chip bonded InGaAs (980 nm) VCSEL array was successfully modulated at data rates up to 0.8 Gbit/s/channel, corresponding to an aggregate data transmission capacity in excess of 50 Gbit/s. A 2×4 GaAs (850 nm) VCSEL array was indirectly flip-chip bonded to a Si substrate via a transparent glass carrier and package-limited data rates of 0.4 Gbit/s/channel were achieved. The large signal modulation bandwidth of these devices exceeded 2 Gbit/s. The electrical driving characteristics of the devices were found to be compatible with 3.3 V CMOS technology.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages10-17
Number of pages8
Volume3631
StatePublished - 1999
EventProceedings of the 1999 Optoelectornic Integrated Circuits and Packaging III - San Jose, CA, USA
Duration: Jan 28 1999Jan 29 1999

Other

OtherProceedings of the 1999 Optoelectornic Integrated Circuits and Packaging III
CitySan Jose, CA, USA
Period1/28/991/29/99

Fingerprint

data links
optical interconnects
Optical interconnects
laser arrays
Surface emitting lasers
surface emitting lasers
chips
high speed
cavities
dummies
data transmission
Data communication systems
CMOS
Modulation
bandwidth
Bandwidth
modulation
Glass
glass
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Ryu, C. M., Koelle, U., Johnson, S., Dowd, P., Turpin, R., Kelkar, P., & Zhang, Y-H. (1999). Optical interconnects for high-speed data links. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3631, pp. 10-17). Society of Photo-Optical Instrumentation Engineers.

Optical interconnects for high-speed data links. / Ryu, C. M.; Koelle, U.; Johnson, Shane; Dowd, P.; Turpin, R.; Kelkar, P.; Zhang, Yong-Hang.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3631 Society of Photo-Optical Instrumentation Engineers, 1999. p. 10-17.

Research output: Chapter in Book/Report/Conference proceedingChapter

Ryu, CM, Koelle, U, Johnson, S, Dowd, P, Turpin, R, Kelkar, P & Zhang, Y-H 1999, Optical interconnects for high-speed data links. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 3631, Society of Photo-Optical Instrumentation Engineers, pp. 10-17, Proceedings of the 1999 Optoelectornic Integrated Circuits and Packaging III, San Jose, CA, USA, 1/28/99.
Ryu CM, Koelle U, Johnson S, Dowd P, Turpin R, Kelkar P et al. Optical interconnects for high-speed data links. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3631. Society of Photo-Optical Instrumentation Engineers. 1999. p. 10-17
Ryu, C. M. ; Koelle, U. ; Johnson, Shane ; Dowd, P. ; Turpin, R. ; Kelkar, P. ; Zhang, Yong-Hang. / Optical interconnects for high-speed data links. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3631 Society of Photo-Optical Instrumentation Engineers, 1999. pp. 10-17
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