On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

K. E. Yazzie, H. X. Xie, J. J. Williams, Nikhilesh Chawla

Research output: Contribution to journalArticlepeer-review

50 Scopus citations

Abstract

The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn-3.9Ag-0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.

Original languageEnglish (US)
Pages (from-to)586-589
Number of pages4
JournalScripta Materialia
Volume66
Issue number8
DOIs
StatePublished - Apr 1 2012

Keywords

  • Cu Sn
  • Ductile fracture
  • Intermetallic compound
  • Mechanical shock
  • Pb-free solder

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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